Inventor

Tetsuyoshi Ogura

Inventor

Osaka, JP

Overview

41→

Patents

1991–2018

Patent span

Electricity

Primary field (CPC H)

Patents· 41 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary

Y10TTechnical subjects covered by former us classification14%

G06FElectric digital data processing13%

H05KPrinted circuits13%

H03HImpedance networks, e.g. resonant circuits9%

H10NElectric solid-state devices not otherwise provided for7%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure6%

G01RMeasuring electric variables5%

G08BSignalling systems, e.g. personal calling systems5%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

PatentTitleYear

10,078,027Pressure sensing element including electrode having protrusion2018 9,904,395'Pressure sensor comprising first pressure sensitive element and second pressure sensitive element'2018 9,814,134'Elastic flexible substrate and manufacturing method thereof'2017 9,752,940'Pressure sensing element comprising electrode including protrusion having elasticity'2017 9,699,893'Elastic flexible substrate and method for manufacturing the same'2017 9,541,518'Electrochemical detector and method for producing same'2017 9,509,303'Pressure-sensitive switch, manufacturing method for same, touch panel including pressure-sensitive switch, and manufacturing method for touch panel'2016 9,508,504'Pressure-sensitive switch, manufacturing method for same, touch panel including pressure-sensitive switch, and manufacturing method for touch panel'2016 9,504,139'Elastic flexible substrate and manufacturing method therefor'2016 9,383,821'Method for presenting tactile sensation and device therefor'2016 9,383,822'Method for presenting tactile sensation and device therefor'2016 9,176,586'Touch panel device with tactile sense presenting function'2015 9,176,587'Tactile sense presentation device and tactile sense presentation method'2015 8,344,264'Semiconductor device and manufacturing process thereof'2013 8,324,623'Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip'2012 7,943,518'Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip'2011 7,814,445'Circuit wiring interference analysis device, interference analysis program, database used in interference analysis device, and asymmetrically connected line model'2010 7,805,265'Method and apparatus for measuring electric circuit parameters'2010 7,788,076'Interference analysis method, interference analysis device, interference analysis program and recording medium with interference analysis program recorded thereon'2010 7,647,034'Design support system and design method for circuit board, and noise analysis program'2010 7,642,973'Electromagnetic wave analysis apparatus and design support apparatus'2010 7,548,792'Equivalent material constant calculation system, storage medium storing an equivalent material constant calculation program, equivalent material constant calculation method, design system, and structure manufacturing method'2009 7,385,286'Semiconductor module'2008 7,379,780'Equivalent material constant calculation system, storage medium storing an equivalent material constant calculation program, equivalent material constant calculation method, design system, and structure manufacturing method'2008 7,056,571'Wiring board and its production process'2006 6,885,788'Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module'2005 6,870,264'Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor'2005 6,774,316'Wiring board and production method thereof'2004 6,615,465'Method for producing an acceleration sensor'2003 6,392,164'Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor'2002 6,270,202'Liquid jetting apparatus having a piezoelectric drive element directly bonded to a casing'2001 6,098,460'Acceleration sensor and shock detecting device using the same'2000 5,982,010'Piezoelectric device and method of manufacturing the same'1999 5,969,463'Energy trapping piezoelectric device and producing method thereof'1999 5,910,699'Method of manufacturing a composite substrate and a piezoelectric device using the substrate'1999 5,759,753'Piezoelectric device and method of manufacturing the same'1998 5,747,857'Electronic components having high-frequency elements and methods of manufacture therefor'1998 5,698,471'Method of manufacturing a composite substrate and a piezoelectric device using the substrate'1997 5,668,057'Methods of manufacture for electronic components having high-frequency elements'1997 5,647,932'Method of processing a piezoelectric device'1997 5,059,671'Manufacturing process of spray urethane elastomer'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991Based in Zushi, JP· patent location history

1997–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (18)· patent assignee history

1997–2018Based in Osaka, JP· patent location history

1999–2010Based in Settsu, JP· patent location history

2005Based in Settu, JP· patent location history

2009–2016Patents assigned to PANASONIC CORP (13)· patent assignee history

2012–2013Patents assigned to HIRANO KOICHI (2)· patent assignee history

2012–2013Patents assigned to OGURA TETSUYOSHI (2)· patent assignee history

2015–2018Patents assigned to PANASONIC IP MAN CO LTD (13)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	18	1997–2008
PANASONIC CORP	13	2009–2016
PANASONIC IP MAN CO LTD	13	2015–2018
HIRANO KOICHI	2	2012–2013
OGURA TETSUYOSHIself	2	2012–2013

Locations

Location	Patents	Span
Osaka, JP	32	1997–2018
Settsu, JP	7	1999–2010
Settu, JP	1	2005
Zushi, JP	1	1991