Inventor

Yasunobu Onishi

Inventor

Yokohama, JP

Overview

40→

Patents

1984–2011

Patent span

Physics

Primary field (CPC G)

Patents· 40 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices46%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds14%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%

C08LCompositions of macromolecular compounds6%

G03CPhotosensitive materials for photographic purposes4%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds1%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients1%

C09DCoating compositions, e.g. paints, varnishes or lacquers1%

G03GElectrography1%

PatentTitleYear

7,968,272'Semiconductor device manufacturing method to form resist pattern'2011 7,794,922'Pattern forming method and method of manufacturing semiconductor device'2010 7,687,227'Resist pattern forming method and manufacturing method of semiconductor device'2010 7,319,944'Method for a predicting a pattern shape by using an actual measured dissolution rate of a photosensitive resist'2008 7,300,884'Pattern forming method, underlayer film forming composition, and method of manufacturing semiconductor device'2007 7,198,886'Method for forming pattern'2007 7,026,099'Pattern forming method and method for manufacturing semiconductor device'2006 6,806,021'Method for forming a pattern and method of manufacturing semiconductor device'2004 6,703,181'Photosensitive composition having uniform concentration distribution of components and pattern formation method using the same'2004 6,576,562'Manufacturing method of semiconductor device using mask pattern having high etching resistance'2003 6,569,595'Method of forming a pattern'2003 6,420,271'Method of forming a pattern'2002 6,270,948'Method of forming pattern'2001 6,225,033'Method of forming a resist pattern'2001 6,054,254'Composition for underlying film and method of forming a pattern using the film'2000 6,025,117'Method of forming a pattern using polysilane'2000 5,994,007'Pattern forming method utilizing first insulative and then conductive overlayer and underlayer'1999 5,889,678'Topography simulation method'1999 RE035821'Pattern forming method including the formation of an acidic coating layer on the radiation-sensitive layer'1998 5,744,281'Resist composition for forming a pattern and method of forming a pattern wherein the composition 4-phenylpyridine as an additive'1998 5,658,706'Resist composition for forming a pattern comprising a pyridinium compound as an additive'1997 5,580,702'Method for forming resist patterns'1996 5,403,695'Resist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groups'1995 5,326,675'Pattern forming method including the formation of an acidic coating layer on the radiation-sensitive layer'1994 5,279,921'Pattern formation resist and pattern formation method'1994 5,198,520'Polysilanes, polysiloxanes and silicone resist materials containing these compounds'1993 5,100,768'Photosensitive composition'1992 5,091,282'Alkali soluble phenol polymer photosensitive composition'1992 5,063,134'Photosensitive composition'1991 5,017,453'A silicone resist materials containing a polysiloxane and a photo-sensitive agent'1991 4,988,601'Photosensitive resin composition with o-quinone diazide and novolac resins prepared from mixed phenolic reactants to include 3,5-xylenol and 2,5-xylenol'1991 4,871,646'Polysilane compound and photosensitive composition'1989 4,835,193'Photopolymerizable epoxy resin composition'1989 4,828,958'Photosensitive composition and method of forming a resist pattern with copolymer of polyvinyl phenol'1989 4,822,716'Polysilanes, Polysiloxanes and silicone resist materials containing these compounds'1989 4,666,951'Photo-curable epoxy resin composition'1987 4,495,042'Photo-curable epoxy resin composition'1985 4,479,860'Photo-curable epoxy resin composition'1984 4,476,290'Photocurable silicon compound composition'1984 4,465,752'Organic photoconductive compositions for use in electrophotography'1984

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1984–1987Patents assigned to TOKYO SHIBAURA ELECTRIC CO (5)· patent assignee history

1984–2011Based in Yokohama, JP· patent location history

1989–2011Patents assigned to TOSHIBA KK (35)· patent assignee history

1989–1993Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TOSHIBA KK	35	1989–2011
TOKYO SHIBAURA ELECTRIC CO	5	1984–1987

Locations

Location	Patents	Span
Yokohama, JP	37	1984–2011
Kanagawa, JP	3	1989–1993