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Inventor

Koichi Araki

Inventor
Kyoto, JP

Overview

3→
Patents
1997–1998
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests22%
PatentTitleYear
5,834,035'Method of and apparatus for molding resin to seal electronic parts'19985,753,538'Method of sealing electronic parts with molded resin and mold employed therefor'19985,603,879'Method of molding resin to seal electronic parts using two evacuation steps'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–1998Patents assigned to TOWA CORP (3)· patent assignee history
1997–1998Based in Kyoto, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOWA CORP31997–1998
Locations
LocationPatentsSpan
Kyoto, JP31997–1998