Inventor

Jia-long HU

Inventor
TW

Overview

1→
Patents
2023
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Bprimary
B29BPreparation or pretreatment of the material to be shaped11%
B29CShaping or joining of plastics11%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts11%
B29LIndexing scheme associated with subclass b29c, relating to particular articles11%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering11%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds11%
C08JWorking-up11%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients11%
C08LCompositions of macromolecular compounds11%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023Patents assigned to UNIV NAT TAIPEI TECHNOLOGY (1)· patent assignee history
2023Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNIV NAT TAIPEI TECHNOLOGY12023
Locations
LocationPatentsSpan
TW12023