Inventor
Hideyasu Murooka
Inventor
Yokohama, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests16%
B29CShaping or joining of plastics11%
B30BPresses in general11%
Y10TTechnical subjects covered by former us classification11%
B29LIndexing scheme associated with subclass b29c, relating to particular articles5%
PatentTitleYear
5,480,048'Multilayer wiring board fabricating method'19965,388,328'Process for fabricating an interconnected multilayer board'19955,300,735'Interconnected multilayer boards and fabrication processes thereof'19945,182,121'Hot press'19934,908,087'Method of forming a multilayer printed circuit board and apparatus therefor'19904,557,792'Hot press'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–1996Patents assigned to HITACHI LTD (6)· patent assignee history
1985–1996Based in Yokohama, JP· patent location history
1993Patents assigned to HITACHI TECHNO ENG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 6 | 1985–1996 |
| HITACHI TECHNO ENG | 1 | 1993 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 6 | 1985–1996 |