Inventor

Edoardo Campini

Inventor
Mesa, AZ, US

Overview

28→
Patents
1998–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing33%
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
G02BOptical elements, systems or apparatus4%
H01RElectrically-conductive connections4%
H04BTransmission4%
H04LTransmission of digital information, e.g. telegraphic communication4%
B01DSeparation2%
H04QSelecting2%
H04WWireless communication networks2%
PatentTitleYear
8,913,379'Telecommunications chassis having mezzanine card interfaces'20148,498,309'Data transport module'20138,351,198'Telecommunications chassis having mezzanine card slots'20137,941,699'Determining a set of processor cores to boot'20117,751,333'Method and apparatus to couple a module to a management controller on an interconnect'20107,715,208'Configurable multi-faceted input/output panel'20107,714,433'Piezoelectric cooling of a semiconductor package'20107,631,133'Backplane interconnection system and method'20097,551,446'Thermal management device attachment'20097,539,184'Reconfigurable interconnect/switch for selectably coupling network devices, media, and switch fabric'20097,525,219'Providing power to a module'20097,487,280'Enabling ports on a module received in a slot in a chassis'20097,458,815'Module to couple to a plurality of backplanes in a chassis'20087,450,796'Radiation switch'20087,359,210'Shock absorbing system for circuit boards'20087,336,505'Deployable faceplate label surface'20087,272,274'Module to couple to an electrical and an optical backplane in a chassis'20077,266,627'Method and apparatus to couple a rear transition module to a carrier board'20077,255,578'Two-dimensional adjustable edge connector adaptor'20077,183,500'Electromagnetic interference (EMI) filter with passive noise cancellation'20077,172,432'Stacked multiple connection module'20077,170,753'Interface enhancement for modular platform applications'20077,145,774'Backside cooling apparatus for modular platforms'20067,133,287'ATCA integrated heatsink and core power distribution mechanism'20067,083,422'Switching system'20066,935,868'Adjustable-width, dual-connector card module'20055,999,990'Communicator having reconfigurable resources'1999D0396470'Palm-top remote control'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–1999Patents assigned to MOTOROLA INC (2)· patent assignee history
1998–2014Based in Mesa, AZ, US· patent location history
2005–2014Patents assigned to INTEL CORP (26)· patent assignee history
2013–2014Patents assigned to CAMPINI EDOARDO (3)· patent assignee history
2013–2014Patents assigned to DENIES STEVEN (2)· patent assignee history
2013–2014Patents assigned to GUTHRIE LAWSON (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP262005–2014
CAMPINI EDOARDOself32013–2014
DENIES STEVEN22013–2014
GUTHRIE LAWSON22013–2014
MOTOROLA INC21998–1999
Locations
LocationPatentsSpan
Mesa, AZ, US281998–2014