Inventor

TIN-HAO KUO

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 95 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices33%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%

H10DInorganic electric semiconductor devices3%

H05KPrinted circuits2%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%

Y10TTechnical subjects covered by former us classification1%

B23KSoldering or unsoldering1%

G02BOptical elements, systems or apparatus1%

H01RElectrically-conductive connections1%

PatentTitleYear

12,557,681Semiconductor package and method of manufacturing the same2026 12,412,817Integrated circuit package and method2025 12,368,141IPD modules with flexible connection scheme in packaging2025 12,354,926Package and method for manufacturing the same2025 12,322,706Chip package and method of forming the same2025 12,300,571Integrated circuit package and method2025 12,300,618Semiconductor device having a heat dissipation structure connected chip package2025 12,278,208Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer2025 12,261,126Semiconductor package2025 12,255,184Semiconductor packages and methods of forming the same2025 12,255,196Semiconductor package with thermal relaxation block and manufacturing method thereof2025 12,255,174Bonding passive devices on active dies to form 3D packages2025 12,230,513Cross-wafer RDLs in constructed wafers2025 12,218,006System, device and methods of manufacture2025 12,205,923Semiconductor device, circuit board structure and manufacturing method thereof2025 12,199,051Integrated circuit structure and method2025 12,159,851Package structure having hollow cylinders and method of fabricating the same2024 12,159,839Semiconductor packages2024 12,142,597Integrated fan-out package and the methods of manufacturing2024 12,136,612Three-dimension large system integration2024 12,125,804Semiconductor package and manufacturing method thereof2024 12,087,718Bump structure having a side recess and semiconductor structure including the same2024 12,080,615Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors2024 12,074,143Integrated circuit package and method2024 12,057,405Packages with thick RDLs and thin RDLs stacked alternatingly2024 12,051,666Package structure and manufacturing method of package structure thereof2024 12,040,281Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof2024 12,014,979Methods of forming semiconductor packages2024 12,014,976Chip package structure including a silicon substrate interposer and methods for forming the same2024 12,009,281Package structure and method of manufacturing the same2024 11,990,381Integrated circuit packages having support rings2024 11,961,810Solderless interconnection structure and method of forming same2024 11,923,349Semiconductor structures2024 11,923,318Method of manufacturing semiconductor package2024 11,908,706Cross-wafer RDLs in constructed wafers2024 11,855,016Semiconductor device and method of manufacture2023 11,854,986Chamfered die of semiconductor package and method for forming the same2023 11,848,233Semiconductor package and manufacturing method thereof2023 11,848,235System, device and methods of manufacture2023 11,848,300Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer2023 11,848,319Multi-chip semiconductor package2023 11,837,575Bonding passive devices on active device dies to form 3D packages2023 11,830,866Semiconductor package with thermal relaxation block and manufacturing method thereof2023 11,824,017Semiconductor package and manufacturing method thereof2023 11,804,443Segregated power and ground design for yield improvement2023 11,798,925IPD modules with flexible connection scheme in packaging2023 11,776,905Package structure, package-on-package structure and manufacturing method thereof2023 11,776,880Surface treatment method and apparatus for semiconductor packaging2023 11,764,171Integrated circuit structure and method2023 11,749,640Semiconductor package and method of manufacturing the same2023 11,749,582Package structure2023 11,694,966Chip package and method of forming the same2023 11,694,943Semiconductor device including heat dissipation structure and fabricating method of the same2023 11,682,626Chamfered die of semiconductor package and method for forming the same2023 11,682,655Semiconductor packages and methods of forming the same2023 11,658,143Bump-on-trace design for enlarge bump-to-trace distance2023 11,646,255Chip package structure including a silicon substrate interposer and methods for forming the same2023 11,631,648Bump structure having a side recess and semiconductor structure including the same2023 11,569,202Semiconductor device, circuit board structure and manufacturing method thereof2023 11,538,788Integrated fan-out stacked package with fan-out redistribution layer (RDL)2022 11,538,735Method of forming integrated circuit packages with mechanical braces2022 11,532,529Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors2022 11,532,594Integrated fan-out package and the methods of manufacturing2022 11,515,268Semiconductor package and manufacturing method thereof2022 11,508,656Semiconductor package and method2022 11,508,671Semiconductor package and manufacturing method thereof2022 11,508,665Packages with thick RDLs and thin RDLs stacked alternatingly2022 11,502,013Integrated circuit package and method2022 11,502,039Semiconductor package and method2022 11,495,590Multi-chip semiconductor package2022 11,488,897Integrated circuit package and method2022 11,456,249Package structure, package-on-package structure and manufacturing method thereof2022 11,444,002Package structure2022 11,424,213Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure2022 11,417,638Semiconductor structures2022 11,417,633Integrated circuit package and method2022 11,404,316System, device and methods of manufacture2022 11,355,466Package structure and manufacturing method of package structure thereof2022 11,342,295Electronic assembly, package structure having hollow cylinders and method of fabricating the same2022 11,322,421Package structure and method of forming the same2022 11,315,805Cross-wafer RDLs in constructed wafers2022 11,315,896Conical-shaped or tier-shaped pillar connections2022 11,309,302Manufacturing method of semiconductor package including thermal conductive block2022 11,309,294Integrated fan-out packages and methods of forming the same2022 11,296,062Three-dimension large system integration2022 11,289,373Semiconductor package and manufacturing method thereof2022 11,282,791Semiconductor device having a heat dissipation structure connected chip package2022 11,239,135Package structure and method of manufacturing the same2022 11,211,346Semiconductor device and method of manufacture2021 11,205,636Semiconductor package and method of manufacturing the same2021 11,201,118Chip package and method of forming the same2021 11,183,487Integrated circuit package and method2021 11,177,192Semiconductor device including heat dissipation structure and fabricating method of the same2021 11,164,819Semiconductor package and manufacturing method thereof2021 11,158,576Package structure having redistribution layer structures2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (95)· patent assignee history

2021–2026Based in TW· patent location history

2025Patents assigned to TAIWNA SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	95	2021–2026
TAIWNA SEMICONDUCTOR MFG COMPANY LTD	1	2025

Locations

Location	Patents	Span
TW	95	2021–2026