Inventor
CHIEN-HAO HSU
Inventor
TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices42%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H10DInorganic electric semiconductor devices8%
H01RElectrically-conductive connections4%
H05KPrinted circuits4%
PatentTitleYear
12,581,935Stacked via structures and methods for forming the same202612,550,710Semiconductor die202612,532,738Chip package structure with heat conductive layer202612,519,055Stacking via configuration for advanced silicon node products and methods for forming the same202612,482,766MIMcap corner structures in the keep-out zones of a semiconductor die and methods of forming the same202512,476,211Semiconductor device202512,021,048Semiconductor device202412,009,327Semiconductor die202411,791,576Electrical connector assembly and electrical connector thereof202311,450,588Method for forming chip package structure with heat conductive layer202211,222,859Semiconductor device structure with bonding pad and method for forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (10)· patent assignee history
2022–2026Based in TW· patent location history
2023Patents assigned to PEGATRON CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 10 | 2022–2026 |
| PEGATRON CORP | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 11 | 2022–2026 |