Inventor
MENG-JEN WANG
Inventor
TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H05KPrinted circuits8%
G06VImage or video recognition or understanding5%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
PatentTitleYear
12,438,128Semiconductor device package202512,272,671Semiconductor device package and method for manufacturing the same202512,068,259Semiconductor device package and method of manufacturing the same202412,009,353Optical device package with compatible lid and carrier202412,009,313Semiconductor package shielding structure202411,887,967Semiconductor device package and method of manufacturing the same202411,682,653Semiconductor device package and method for manufacturing the same202311,626,525Package structure and method for manufacturing the same202311,605,598Semiconductor device package and method of manufacturing the same202311,302,682Optical device package202211,139,274Semiconductor device package and method of manufacturing the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to ADVANCED SEMICONDUCTOR ENG (11)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 11 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 11 | 2021–2025 |