Inventor

Syed Sajid Ahmad

Inventor

Boise, ID, US

Overview

1989–2011

Patent span

Electricity

Primary field (CPC H)

Patents· 55 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1045%

H05KPrinted circuits19%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering8%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

Y02PClimate change mitigation technologies in the production or processing of goods6%

H10DInorganic electric semiconductor devices5%

G01RMeasuring electric variables4%

Y10TTechnical subjects covered by former us classification4%

B41MPrinting, duplicating, marking, or copying processes1%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds1%

PatentTitleYear

7,928,579'Devices including sloped vias in a substrate and devices including spring-like deflecting contacts'2011 7,589,010'Semiconductor devices with permanent polymer stencil and method for manufacturing the same'2009 7,390,740'Sloped vias in a substrate, spring-like contacts, and methods of making'2008 7,169,693'Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same'2007 7,095,106'Collars, support structures, and forms for protruding conductive structures'2006 7,087,116'Apparatus for modifying the configuration of an exposed surface of a viscous fluid'2006 7,041,533'Stereolithographic method for fabricating stabilizers for semiconductor devices'2006 6,998,334'Semiconductor devices with permanent polymer stencil and method for manufacturing the same'2006 6,983,551'Interconnecting substrates for electrical coupling of microelectronic components'2006 6,982,386'Interconnecting substrates for electrical coupling of microelectronic components'2006 6,979,598'Method of attaching a leadframe to singulated semiconductor dice'2005 6,946,732'Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same'2005 6,919,229'Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid'2005 6,911,735'Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same'2005 6,890,384'Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid'2005 6,818,460'Method for applying adhesives to a lead frame'2004 6,803,657'Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components'2004 6,796,028'Method of Interconnecting substrates for electrical coupling of microelectronic components'2004 6,706,559'Method of attaching a leadframe to singulated semiconductor dice'2004 6,703,260'Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes'2004 6,642,730'Test carrier with molded interconnect for testing semiconductor components'2003 6,602,730'Method for gravitation-assisted control of spread of viscous material applied to a substrate'2003 6,569,753'Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same'2003 6,544,461'Test carrier with molded interconnect for testing semiconductor components'2003 6,528,867'Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice'2003 6,525,408'Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same'2003 6,506,628'Method of attaching a leadframe to singulated semiconductor dice'2003 6,500,697'Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes'2002 6,492,713'Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components'2002 6,489,681'Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components'2002 6,485,778'Method of applying an adhesive material to lead fingers of a lead frame'2002 6,483,044'Interconnecting substrates for electrical coupling of microelectronic components'2002 6,436,732'Apparatus for applying viscous materials to a lead frame'2002 6,353,326'Test carrier with molded interconnect for testing semiconductor components'2002 6,346,152'Method and apparatus for applying adhesives to a lead frame'2002 6,336,973'Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid'2002 6,336,974'Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid'2002 6,331,448'Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes'2001 6,329,705'Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes'2001 6,316,952'Flexible conductive structures and method'2001 6,312,977'Method of attaching a leadframe to singulated semiconductor dice'2001 6,204,093'Method and apparatus for applying viscous materials to a lead frame'2001 6,200,832'Apparatus for applying viscous materials to a lead frame'2001 6,200,833'Method of attaching a leadframe to singulated semiconductor dice'2001 6,194,251'Die positioning in integrated circuit packaging'2001 6,110,761'Methods for simultaneously electrically and mechanically attaching lead frames to semiconductor dice and the resulting elements'2000 6,083,768'Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components'2000 6,040,205'Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid'2000 6,017,776'Method of attaching a leadframe to singulated semiconductor dice'2000 6,013,535'Method for applying adhesives to a lead frame'2000 5,994,784'Die positioning in integrated circuit packaging'1999 5,960,712'Screens for use in a screen printing system'1999 5,759,875'Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use'1998 5,616,953'Lead frame surface finish enhancement'1997 4,810,523'Pressure-sensitive adhesives'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989Patents assigned to NEUTRON PRODUCTS INC (1)· patent assignee history

1989Based in Lanham, MD, US· patent location history

1997–2011Patents assigned to MICRON TECHNOLOGY INC (53)· patent assignee history

1997–2009Based in Boise, ID, US· patent location history

2011Based in Fargo, ND, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MICRON TECHNOLOGY INC	53	1997–2011
NEUTRON PRODUCTS INC	1	1989

Locations

Location	Patents	Span
Boise, ID, US	53	1997–2009
Fargo, ND, US	1	2011
Lanham, Maryland, US	1	1989