Inventor
Rodel Manalac
Inventor
Singapore, SG
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
8,592,258'Semiconductor package and method of attaching semiconductor dies to substrates'20138,247,272'Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process'20127,109,570'Integrated circuit package with leadframe enhancement and method of manufacturing the same'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2013Based in Singapore, SG· patent location history
2012–2013Patents assigned to ENG KIAN TENG (2)· patent assignee history
2012–2013Patents assigned to MANALAC RODEL (2)· patent assignee history
2012–2013Patents assigned to ONG PANG HUP (2)· patent assignee history
2012–2013Patents assigned to UNITED TEST & ASSEMBLY CT LT (2)· patent assignee history
2013Patents assigned to AMMER FLORIAN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ENG KIAN TENG | 2 | 2012–2013 |
| MANALAC RODELself | 2 | 2012–2013 |
| ONG PANG HUP | 2 | 2012–2013 |
| UNITED TEST & ASSEMBLY CT LT | 2 | 2012–2013 |
| AMMER FLORIAN | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 3 | 2006–2013 |