Inventor
CHIA-WEI LIU
Inventor
TW
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10BElectronic memory devices9%
H10NElectric solid-state devices not otherwise provided for9%
H10DInorganic electric semiconductor devices7%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
G11CStatic stores3%
B24BMachines, devices, or processes for grinding or polishing2%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
PatentTitleYear
12,453,298Resistive random access memory device202512,448,279Semiconductor structure and method of manufacturing the same202512,415,718Impact-resistant micromechanical arms202512,400,947Variable graduated capacitor structure and methods for forming the same202512,396,179Resistive random access memory device202512,368,349Composite two-phase fluid cooling motor and composite two-phase fluid cooling device thereof202512,261,129Damping device and method of making202512,243,839Bonded semiconductor structure utilizing concave/convex profile design for bonding pads202512,239,034Resistive random access memory device having needle-like-shaped top electrode region and method for fabricating the same202512,237,280Cavity resonator for enhancing radio-frequency performance and methods for forming the same202512,205,901Plasma-damage-resistant interconnect structure and methods for forming the same202512,191,247Variable graduated capacitor structure and methods for forming the same202512,178,136Semiconductor device and method for fabricating the same202412,165,868Semiconductor device in a containment structure including a buried layer202412,131,915Pit-less chemical mechanical planarization process and device structures made therefrom202412,027,431Semiconductor structure and method of making202411,950,433Resistive random access memory device202411,935,854Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads202411,914,915Near eye display apparatus202411,892,639Display device having display area with luminous pixels over curved surface of semiconductor substrate for use in near-eye display202411,848,291Cavity resonator for enhancing radio-frequency performance and methods for forming the same202311,778,917Semiconductor device and method for fabricating the same202311,772,962MEMS package and forming method thereof202311,728,272Plasma-damage-resistant interconnect structure and methods for manufacturing the same202311,710,632Method of manufacturing at least one semiconductor device on or in a base semiconductor material disposed in a containment structure including a buried layer202311,705,340Pit-less chemical mechanical planarization process and device structures made therefrom202311,678,592Step height mitigation in resistive random access memory structures202311,640,949Bonded semiconductor structure utilizing concave/convex profile design for bonding pads202311,621,731Client wireless device that merges functions of upper and lower MAC layers to support WLAN modules operating simultaneously in different wireless bands202311,587,824Method for manufacturing semiconductor structure202311,489,011Resistive random access memory device202211,476,288Infrared image sensor component manufacturing method2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (25)· patent assignee history
2022–2025Based in TW· patent location history
2023–2025Patents assigned to UNITED MICROELECTRONICS CORP (5)· patent assignee history
2023Patents assigned to NETGEAR INC (1)· patent assignee history
2023Based in US· patent location history
2025Patents assigned to TECO ELECTRIC & MACHINERY CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 25 | 2022–2025 |
| UNITED MICROELECTRONICS CORP | 5 | 2023–2025 |
| NETGEAR INC | 1 | 2023 |
| TECO ELECTRIC & MACHINERY CO LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 31 | 2022–2025 |
| US | 1 | 2023 |