Inventor

Ziwei Fang

Inventor
Hsinchu, TW

Overview

83→
Patents
2001–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 83 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H01LSemiconductor devices26%
H10DInorganic electric semiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H01JElectric discharge tubes or discharge lamps6%
C23CCoating metallic material1%
B82YSpecific uses or applications of nanostructures1%
A61BDiagnosis0%
G01NInvestigating or analysing materials by determining their chemical or physical properties0%
H10BElectronic memory devices0%
PatentTitleYear
10,879,246Methods of fabricating semiconductor devices having gate-all-around structure with oxygen blocking layers202010,872,970Source and drain formation technique for fin-like field effect transistor202010,868,151Conformal transfer doping method for fin-like field effect transistor202010,868,140Gap-filling germanium through selective bottom-up growth202010,868,171Semiconductor device structure with gate dielectric layer and method for forming the same202010,861,751Method of semiconductor integrated circuit fabrication202010,854,729Method to reduce etch variation using ion implantation202010,854,503Semiconductor structure with air gap and method sealing the air gap202010,847,431Ion implantation methods and structures thereof202010,818,768Method for forming metal cap layers to improve performance of semiconductor structure202010,811,253Methods of fabricating semiconductor devices having crystalline high-K gate dielectric layer202010,770,563Gate structure and patterning method for multiple threshold voltages202010,749,008Gate structure, semiconductor device and the method of forming semiconductor device202010,720,431Methods of fabricating semiconductor devices having gate-all-around structure with oxygen blocking layers202010,720,529Source/drain junction formation202010,707,320Field effect transistors with ferroelectric dielectric materials202010,685,867Method of semiconductor integrated circuit fabrication202010,686,074Fin field effect transistor (FinFET) device structure with doped region in source/drain structure and method for forming the same202010,685,884Semiconductor device including a Fin-FET and method of manufacturing the same202010,665,717Semiconductor device and FinFET device202010,629,596Fin-type field effect transistor structure and manufacturing method thereof202010,573,749Fin-type field effect transistor structure and manufacturing method thereof202010,541,175Structure and formation method of semiconductor device with fin structures202010,535,557Interlayer dielectric film in semiconductor devices202010,515,963Field effect transistor contact with reduced contact resistance201910,515,809Selective high-K formation in gate-last process201910,490,648Method to reduce etch variation using ion implantation201910,483,170Method of semiconductor integrated circuit fabrication201910,468,501Gap-filling germanium through selective bottom-up growth201910,431,670Source and drain formation technique for fin-like field effect transistor201910,276,691Conformal transfer doping method for fin-like field effect transistor201910,269,799Field effect transistor contact with reduced contact resistance201910,249,530Interlayer dielectric film in semiconductor devices201910,158,019Source/drain junction formation201810,141,417Gate structure, semiconductor device and the method of forming semiconductor device201810,115,624Method of semiconductor integrated circuit fabrication201810,062,780FinFET device201810,049,918Directional patterning methods201810,026,811Integrated circuit structure and method with solid phase diffusion201810,008,497Method of manufacturing a semiconductor device and a semiconductor device201810,008,418Method of semiconductor integrated circuit fabrication201810,002,867Fin-type field effect transistor structure and manufacturing method thereof20189,881,840'Method of fabricating gate electrode using a treated hard mask'20189,865,515'Ion implantation methods and structures thereof'20189,812,451'Field effect transistor contact with reduced contact resistance'20179,748,390'Semiconductor device and method of forming the same'20179,722,083'Source/drain junction formation'20179,722,081'FinFET device and method of forming the same'20179,634,141'Interlayer dielectric film in semiconductor devices'20179,564,530'Integrated circuit structure and method with solid phase diffusion'20179,537,010'Semiconductor device structure and method for forming the same'20179,508,556'Method for fabricating fin field effect transistor and semiconductor device'20169,412,838'Ion implantation methods and structures thereof'20169,401,414'Semiconductor device and method of forming the same'20169,396,986'Mechanism of forming a trench structure'20169,373,529'Process tool having third heating source and method of using the same'20169,324,865'Method of forming a semiconductor device'20169,281,196'Method to reduce etch variation using ion implantation'20169,184,088'Method of making a shallow trench isolation (STI) structures'20158,999,794'Self-aligned source and drain structures and method of manufacturing same'20158,927,377'Methods for forming FinFETs with self-aligned source/drain'20158,927,359'Multi-composition dielectric for semiconductor device'20158,890,258'Semiconductor device and method of forming the same'20148,877,602'Mechanisms of doping oxide for forming shallow trench isolation'20148,877,599'Method of forming a semiconductor device'20148,853,025'FinFET/tri-gate channel doping for multiple threshold voltage tuning'20148,809,171'Methods for forming FinFETs having multiple threshold voltages'20148,592,915'Doped oxide for shallow trench isolation (STI)'20138,501,570'Method of manufacturing source/drain structures'20138,450,193'Techniques for temperature-controlled ion implantation'20137,878,145'Monitoring plasma ion implantation systems for fault detection and process control'20117,687,787'Profile adjustment in plasma ion implanter'20107,528,389'Profile adjustment in plasma ion implanter'20097,476,849'Technique for monitoring and controlling a plasma process'20097,453,059'Technique for monitoring and controlling a plasma process'20087,397,048'Technique for boron implantation'20087,396,746'Methods for stable and repeatable ion implantation'20086,528,805'Dose monitor for plasma doping system'20036,527,918'Method and apparatus for low voltage plasma doping using dual pulses'20036,500,496'Hollow cathode for plasma doping system'20026,335,536'Method and apparatus for low voltage plasma doping using dual pulses'20026,300,643'Dose monitor for plasma doping system'20016,182,604'Hollow cathode for plasma doping system'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2013Patents assigned to VARIAN SEMICONDUCTOR EQUIPMENT (14)· patent assignee history
2001–2003Based in Sunnyvale, CA, US· patent location history
2008–2013Based in Beverly, MA, US· patent location history
2013–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (14)· patent assignee history
2013–2018Patents assigned to FANG ZIWEI (7)· patent assignee history
2013–2018Patents assigned to HUANG YU-LIEN (3)· patent assignee history
2013–2020Based in Hsinchu, TW· patent location history
2013–2020Based in Baoshan Township, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (55)· patent assignee history
2017–2018Based in Hsinchu County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD552016–2020
TAIWAN SEMICONDUCTOR MFG142013–2016
VARIAN SEMICONDUCTOR EQUIPMENT142001–2013
FANG ZIWEIself72013–2018
HUANG YU-LIEN32013–2018
Locations
LocationPatentsSpan
Hsinchu, TW542013–2020
Baoshan Township, TW132013–2020
Beverly, Massachusetts, US82008–2013
Sunnyvale, California, US62001–2003
Hsinchu County, TW22017–2018