Inventor
Kuo-Pin Yang
Inventor
Kaohsiung, TW
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H01LSemiconductor devices13%
H10DInorganic electric semiconductor devices9%
B81BMicrostructural devices or systems, e.g. micromechanical devices6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems2%
G01RMeasuring electric variables2%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers2%
H05KPrinted circuits2%
PatentTitleYear
11,133,270Integrated circuit device and fabrication method thereof202111,127,700Integrated circuit device202111,114,562Semiconductor device202111,101,165Method for fabricating semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate202111,094,599Semiconductor structure and manufacturing method thereof20218,865,520'Carrier bonding and detaching processes for a semiconductor wafer'20148,643,167'Semiconductor package with through silicon vias and method for making the same'20148,471,156'Method for forming a via in a substrate and substrate with a via'20138,314,490'Chip having a bump and package having the same'20128,188,593'Silicon substrate having through vias and package having the same'20127,945,062'Microelectromechanical microphone packaging system'20117,833,815'Microelectromechanical system package and the method for manufacturing the same'20107,573,124'Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same'20097,563,652'Method for encapsulating sensor chips'20097,560,744'Package optical chip with conductive pillars'20097,435,621'Method of fabricating wafer level package'20087,429,499'Method of fabricating wafer level package'20087,238,590'Package structure of semiconductor and wafer-level formation thereof'20077,105,424'Method for preparing arylphosphonite antioxidant'20066,768,332'Semiconductor wafer and testing method for the same'20046,369,439'Strip of semiconductor package'20026,150,730'Chip-scale semiconductor package'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2014Patents assigned to ADVANCED SEMICONDUCTOR ENG (17)· patent assignee history
2000–2014Based in Kaohsiung, TW· patent location history
2008–2010Based in Meinong Township, TW· patent location history
2012–2014Patents assigned to YANG KUO-PIN (5)· patent assignee history
2014Patents assigned to CHANG HUI-SHAN (1)· patent assignee history
2014Patents assigned to CHEN JEN-CHUAN (1)· patent assignee history
2021Patents assigned to UNITED MICROELECTRONICS CORP (5)· patent assignee history
2021Based in Hsinchu County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 17 | 2000–2014 |
| UNITED MICROELECTRONICS CORP | 5 | 2021 |
| YANG KUO-PINself | 5 | 2012–2014 |
| CHANG HUI-SHAN | 1 | 2014 |
| CHEN JEN-CHUAN | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 15 | 2000–2014 |
| Hsinchu County, TW | 5 | 2021 |
| Meinong Township, TW | 2 | 2008–2010 |