Inventor
Chen-Hsiu Lin
Inventor
Taipei, TW
Overview
Patents· 67 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H01LSemiconductor devices17%
LOC1316%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted4%
F21KNon-electric light sources using luminescence3%
F21VFunctional features or details of lighting devices or systems thereof3%
A61BDiagnosis2%
H05KPrinted circuits2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
11,132,790Wafer map identification method and computer-readable recording medium202110,879,443LED package structure, chip carrier, and method for manufacturing chip carrier202010,777,723LED package structure, heat-dissipating substrate, method for manufacturing LED package structure, and method for manufacturing heat-dissipating substrate202010,727,383LED package structure202010,690,538Optical sensor module and a wearable device including the same202010,686,096Optical sensor module and a wearable device including the same202010,655,828LED package structure202010,658,556LED package structure and multilayer circuit board202010,573,797LED packages structure, heat-dissipating substrate, and method for manufacturing heat-dissipating substrate202010,170,673LED package structure and multilayer circuit board201910,155,903Metal etchant compositions and methods of fabricating a semiconductor device using the same201810,134,939Optical sensor module and a wearable device including the same20189,748,454'LED package structure and chip carrier'20179,735,320'LED packages and manufacturing method thereof'20179,705,052'LED package structure'20179,691,936'Manufacturing method of LED carrier'20179,583,689'LED package'20179,515,241'LED structure, metallic frame of LED structure, and carrier module'20169,508,698'Light emitting device'20169,441,817'Light-emitting structure'20169,412,724'Chip-scale packaged LED device'20169,397,277'LED packages and manufacturing method thereof'20169,362,472'LED carrier and manufacturing method thereof'20169,099,625'LED package and metallic frame thereof'20159,074,735'Light emitting diode package'20159,076,943'Lead frame structure, a packaging structure and a lighting unit thereof'20159,029,905'Light emitting diode device'20158,937,375'Substrate structure, semiconductor device array and semiconductor device having the same'20158,933,481'Lead frame assembly, LED package and LED light bar'20158,829,561'Metallic frame structure and LED device having the same'20148,729,586'Light-emitting diode device'20148,729,681'Package structure and LED package structure'20148,569,777'Lead frame unit, package structure and light emitting diode device having the same'20138,455,970'Lead frame assembly, package structure and LED package structure'2013D0674758'Light emitting diode'2013D0674757'Package carrier of light emitting diode'2013D0674358'LED package'2013D0674362'LED package'2013D0674359'LED package'2013D0674360'LED package'2013D0674363'LED package'2013D0674361'LED package'2013D0674357'LED package'20138,319,245'Lead frame, and light emitting diode module having the same'20128,303,133'Light emitting diode, backlight module, and light tube'2012D0665365'Light-emitting diode'20128,089,140'Lead frame assembly, lead frame and insulating housing combination, and led module having the same'2012D0646643'Light emitting diode'2011D0645424'Light emitting diode carrier'2011D0645425'Light emitting diode carrier'2011D0640996'Packing structure of light-emitting diode'2011D0640994'Packing structure of light-emitting diode'2011D0640995'Packing structure of light-emitting diode'2011D0637565'Light emitting diode'20117,919,788'Assembly of a heat dissipating base and a lead frame for a light emitting diode packaging device and method for making the same'2011D0627310'Package of a light emitting diode'2010D0624885'LED package structure'2010D0622680'Package of a light emitting diode'20107,764,271'Method of manufacturing an optical module'20107,750,362'Semiconductor light-emitting device'2010D0619110'LED package'2010D0562269'Edge-emitting light emitting diode component'2008D0551383'Edge-emitting light emitting diode component'2007D0550169'Edge-emitting light emitting diode component'2007D0541760'Edge-emitting light emitting diode component'2007D0533146'Edge-emitting light emitting diode component'2006D0527352'Edge-emitting light emitting diode component'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2020Patents assigned to LITE ON TECHNOLOGY CORP (62)· patent assignee history
2006–2014Based in Tu-Cheng, TW· patent location history
2007–2020Based in Taipei, TW· patent location history
2010–2013Patents assigned to SILITEK ELECTRONIC GUANGZHOU (19)· patent assignee history
2011Based in Xinbei, TW· patent location history
2012–2015Patents assigned to LIN CHEN-HSIU (20)· patent assignee history
2013–2014Patents assigned to CHANG YI-CHIEN (10)· patent assignee history
2013–2016Patents assigned to LITE ON ELECTRONICS GUANGZHOU (9)· patent assignee history
2013–2020Based in New Taipei, TW· patent location history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LITE ON TECHNOLOGY CORP | 62 | 2006–2020 |
| LIN CHEN-HSIUself | 20 | 2012–2015 |
| SILITEK ELECTRONIC GUANGZHOU | 19 | 2010–2013 |
| CHANG YI-CHIEN | 10 | 2013–2014 |
| LITE ON ELECTRONICS GUANGZHOU | 9 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 27 | 2007–2020 |
| New Taipei, TW | 24 | 2013–2020 |
| Tu-Cheng, TW | 12 | 2006–2014 |
| Xinbei, TW | 2 | 2011 |
| Hsinchu, TW | 1 | 2021 |