Inventor
Toshiharu Sakurai
Inventor
Yokohama, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
Y10TTechnical subjects covered by former us classification17%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
5,198,883'Semiconductor device having an improved lead arrangement and method for manufacturing the same'19935,096,081'Cover plate for semiconductor devices'19925,091,341'Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member'19925,025,347'Semiconductor device'19914,910,577'Lead frame'19904,855,807'Semiconductor device'19894,654,692'Semiconductor device of resin-seal type'19874,604,642'Fe-Ni-Cu leadframe'19864,482,611'Electronic parts'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1984Patents assigned to TOKYO SHIBAURA ELECTRIC CO (1)· patent assignee history
1984–1992Based in Yokohama, JP· patent location history
1986–1993Patents assigned to TOSHIBA KK (8)· patent assignee history
1992Based in Kitakami, JP· patent location history
1993Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 8 | 1986–1993 |
| TOKYO SHIBAURA ELECTRIC CO | 1 | 1984 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokohama, JP | 7 | 1984–1992 |
| Kanagawa, JP | 1 | 1993 |
| Kitakami, JP | 1 | 1992 |