LexDanaLexDanabeta
Inventor

MIAO-PEI CHEN

Inventor
TW

Overview

3→
Patents
2023–2024
Patent span
Physics
Primary field (CPC G)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties30%
G01BMeasuring length, thickness or similar linear dimensions20%
B24BMachines, devices, or processes for grinding or polishing10%
B28DWorking stone or stone-like materials10%
H01LSemiconductor devices10%
H10DInorganic electric semiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
12,044,631Wafer surface defect inspection method and apparatus thereof202411,971,365Wafer processing system and rework method thereof202411,852,465Wafer inspection method and apparatus thereof2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2024Patents assigned to GLOBALWAFERS CO LTD (3)· patent assignee history
2023–2024Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GLOBALWAFERS CO LTD32023–2024
Locations
LocationPatentsSpan
TW32023–2024