Inventor

CHEE HIONG CHEW

Inventor

MY

Overview

2022–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 53 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%

H01LSemiconductor devices35%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%

H05KPrinted circuits6%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%

H01RElectrically-conductive connections2%

H10DInorganic electric semiconductor devices2%

H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems1%

Y10TTechnical subjects covered by former us classification1%

C04BLime, magnesia1%

PatentTitleYear

12,525,519Semiconductor package with guide pin2026 12,513,870Power module2025 12,444,609Silicon-on-insulator die support structures and related methods2025 12,424,522Leadless semiconductor packages, leadframes therefor, and methods of making2025 12,402,264Stacked power terminals in a power electronics module2025 12,394,692Power circuit module2025 12,374,555Die sidewall coatings and related methods2025 12,374,554Semiconductor packages with die including cavities and related methods2025 12,362,266Low stress asymmetric dual side module2025 12,355,009Low stress asymmetric dual side module2025 12,347,755Low stress asymmetric dual side module2025 12,347,813Semiconductor package and related methods2025 12,347,812Low stress asymmetric dual side module2025 12,300,558Substrates and related methods2025 12,283,562Clip design and method of controlling clip position2025 12,243,810Semiconductor package with wettable flank and related methods2025 12,211,775Multiple substrate package systems and related methods2025 12,176,272Semiconductor package with wettable flank2024 12,040,192Die sidewall coatings and related methods2024 12,033,904Semiconductor package system and related methods2024 11,955,412Low stress asymmetric dual side module2024 11,948,870Low stress asymmetric dual side module2024 11,908,699Semiconductor packages with die including cavities2024 11,908,840Low stress asymmetric dual side module2024 11,901,184Backmetal removal methods2024 11,894,234Semiconductor packages with die support structure for thin die2024 11,894,347Low stress asymmetric dual side module2024 11,830,856Semiconductor package and related methods2023 11,804,421Connecting clip design for pressure sintering2023 11,791,288Reinforced semiconductor die and related methods2023 11,710,687Semiconductor package with guide pin2023 11,672,087Semiconductor package2023 11,569,140Semiconductor package with elastic coupler and related methods2023 11,562,938Spacer with pattern layout for dual side cooling power module2023 11,557,530Semiconductor devices and methods of making the same2023 11,532,539Semiconductor package with wettable flank2022 11,508,679Polymer resin and compression mold chip scale package2022 11,482,468Power module package casing with protrusion supports2022 11,469,163Low stress asymmetric dual side module2022 11,462,515Low stress asymmetric dual side module2022 11,452,225Fin frame assemblies2022 11,437,304Substrate structures and methods of manufacture2022 11,404,277Die sidewall coatings and related methods2022 11,404,276Semiconductor packages with thin die and related methods2022 11,374,373Press-fit pin for semiconductor packages and related methods2022 11,373,939Quad leadframe packages and related methods2022 11,361,970Silicon-on-insulator die support structures and related methods2022 11,348,878Reinforced semiconductor die and related methods2022 11,348,796Backmetal removal methods2022 11,342,189Semiconductor packages with die including cavities and related methods2022 11,342,237Semiconductor package system and related methods2022 11,272,625Method for forming a semiconductor package2022 11,217,506Semiconductor device assemblies including low-stress spacer2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (53)· patent assignee history

2022–2026Based in MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SEMICONDUCTOR COMPONENTS IND LLC	53	2022–2026

Locations

Location	Patents	Span
MY	53	2022–2026