Inventor
Srinivasa S. N. Reddy
Inventor
Lagrangeville, NY, US
Overview
Patents· 53 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H05KPrinted circuits19%
Y10TTechnical subjects covered by former us classification15%
C04BLime, magnesia11%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
C23CCoating metallic material4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
C03CChemical composition of glasses, glazes or vitreous enamels3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
C22CAlloys2%
PatentTitleYear
9,379,007'Electromigration-resistant lead-free solder interconnect structures'20168,910,853'Additives for grain fragmentation in Pb-free Sn-based solder'20148,493,746'Additives for grain fragmentation in Pb-free Sn-based solder'20137,683,493'Intermetallic diffusion block device and method of manufacture'20107,666,780'Alignment verification for C4NP solder transfer'20107,344,679'Method and apparatus for point of care osmolarity testing'20086,974,358'Discrete magnets in dielectric forming metal/ceramic laminate and process thereof'20056,943,108'Interposer capacitor built on silicon wafer and joined to a ceramic substrate'20056,900,395'Enhanced high-frequency via interconnection for improved reliability'20056,791,133'Interposer capacitor built on silicon wafer and joined to a ceramic substrate'20046,653,776'Discrete magnets in dielectric forming metal/ceramic laminate and process thereof'20036,569,496'CVD of metals capable of receiving nickel or alloys thereof using inert contact'20036,565,917'Method of forming features on a ceramic substrate using platible pastes'20036,494,758'Process of forming metal/ferrite laminated magnet'20026,489,686'Multi-cavity substrate structure for discrete devices'20026,413,339'Low temperature sintering of ferrite materials'20026,376,054'Surface metallization structure for multiple chip test and burn-in'20026,358,439'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'20026,339,527'Thin film capacitor on ceramic'20026,319,829'Enhanced interconnection to ceramic substrates'20016,312,791'Multilayer ceramic substrate with anchored pad'20016,258,191'Method and materials for increasing the strength of crystalline ceramic'20016,227,943'Method and system for pre-cleaning and post-cleaning deposited metal'20016,228,682'Multi-cavity substrate structure for discrete devices'20016,224,682'CVD of metals capable of receiving nickel or alloys thereof using inert contact'20016,187,418'Multilayer ceramic substrate with anchored pad'20016,139,666'Method for producing ceramic surfaces with easily removable contact sheets'20006,136,419'Ceramic substrate having a sealed layer'20006,124,041'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'20006,068,912'Platible non-metallic filler material for metallurgical screening paste'20005,925,443'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'19995,869,134'CVD of metals capable of receiving nickel or alloys thereof using iodide'19995,655,213'Co-sintered surface metallization for pin-join, wire-bond and chip attach'19975,639,562'Co-sintered surface metallization for pin-join, wire-bond and chip attach'19975,613,181'Co-sintered surface metallization for pin-join, wire-bond and chip attach'19975,532,031'I/O pad adhesion layer for a ceramic substrate'19965,525,761'Copper-based paste containing refractory metal additions for densification control'19965,512,711'Copper-based paste containing refractory metal additions for densification control'19965,468,445'Ceramic via composition, multilayer ceramic circuit containing same, and process for using same'19955,336,444'Ceramic via composition, multilayer ceramic circuit containing same, and process for using same'19945,304,517'Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering'19945,292,477'Supersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewith'19945,277,725'Process for fabricating a low dielectric composite substrate'19945,167,913'Method of forming an adherent layer of metallurgy on a ceramic substrate'19925,139,851'Low dielectric composite substrate'19925,139,975'Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates'19925,135,595'Process for fabricating a low dielectric composite substrate'19925,073,180'Method for forming sealed co-fired glass ceramic structures'19915,053,361'Setter tile for use in sintering of ceramic substrate laminates'19914,971,738'Enhanced removal of carbon from ceramic substrate laminates'19904,764,341'Bonding of pure metal films to ceramics'19884,659,406'Method of bonding to ceramic and glass'19874,455,202'Electrolytic production of lithium metal'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2014Patents assigned to IBM (51)· patent assignee history
1987–2016Based in Lagrangeville, NY, US· patent location history
1995Based in LeGrangeville, NY, US· patent location history
1997Based in Dutchess County, NY, US· patent location history
2013Patents assigned to ARVIN CHARLES L (1)· patent assignee history
2013Patents assigned to BLANDER ALEXANDRE (1)· patent assignee history
2013Patents assigned to BROFMAN PETER J (1)· patent assignee history
2013Based in Hopewell Junction, NY, US· patent location history
2014Based in Bangalore, IN· patent location history
2016Patents assigned to GLOBALFOUNDRIES INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 51 | 1987–2014 |
| ARVIN CHARLES L | 1 | 2013 |
| BLANDER ALEXANDRE | 1 | 2013 |
| BROFMAN PETER J | 1 | 2013 |
| GLOBALFOUNDRIES INC | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Lagrangeville, New York, US | 46 | 1987–2016 |
| Dutchess County, New York, US | 3 | 1997 |
| Bangalore, IN | 1 | 2014 |
| Hopewell Junction, New York, US | 1 | 2013 |
| LeGrangeville, New York, US | 1 | 1995 |