Inventor
Marc Fueldner
Inventor
Neubiberg, DE
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Rprimary
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers34%
B81BMicrostructural devices or systems, e.g. micromechanical devices22%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems15%
Y10TTechnical subjects covered by former us classification11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H01LSemiconductor devices4%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure3%
G01HMeasurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves1%
G01KMeasuring temperature1%
G01RMeasuring electric variables1%
PatentTitleYear
11,117,798MEMS-sensor202111,115,755Sound transducer structure and method for manufacturing a sound transducer structure202111,053,117MEMS component and production method for a MEMS component202110,981,780Membrane support for dual backplate transducers202110,793,419MEMS assembly202010,737,935MEMS sensors, methods for providing same and method for operating a MEMS sensor202010,689,250MEMS component and production method for a MEMS component202010,589,987System and method for a MEMS transducer202010,567,886Sound transducer structure and method for manufacturing a sound transducer structure202010,464,807Semiconductor device, microphone and method for producing a semiconductor device201910,034,100Sound transducer structure and method for manufacturing a sound transducer structure20189,967,677System and method for sensor-supported microphone20189,668,056'Sound transducer structure and method for manufacturing a sound transducer structure'20179,533,874'Sensor module and semiconductor chip'20179,503,823'Capacitive microphone with insulated conductive plate'20169,179,221'MEMS devices, interface circuits, and methods of making thereof'20159,090,453'Sensor module and semiconductor chip'20158,604,566'Sensor module and semiconductor chip'20138,542,853'Sound transducer structure and method for manufacturing a sound transducer structure'20138,428,286'MEMS microphone packaging and MEMS microphone module'20137,994,618'Sensor module and method for manufacturing same'20117,912,236'Sound transducer structure and method for manufacturing a sound transducer structure'20117,882,612'Method for producing a membrane'20117,502,482'Membrane and method for the production of the same'20097,473,572'Micromechanical sensors and methods of manufacturing same'20097,348,646'Micromechanical capacitive transducer and method for manufacturing the same'20087,190,038'Micromechanical sensors and methods of manufacturing same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2021Patents assigned to INFINEON TECHNOLOGIES AG (27)· patent assignee history
2007–2009Based in Munich, DE· patent location history
2009–2021Based in Neubiberg, DE· patent location history
2013Patents assigned to DEHE ALFONS (3)· patent assignee history
2013Patents assigned to FUELDNER MARC (3)· patent assignee history
2013Patents assigned to BARZEN STEFAN (1)· patent assignee history
2013Patents assigned to WURZER MARTIN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 27 | 2007–2021 |
| DEHE ALFONS | 3 | 2013 |
| FUELDNER MARCself | 3 | 2013 |
| BARZEN STEFAN | 1 | 2013 |
| WURZER MARTIN | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Neubiberg, DE | 24 | 2009–2021 |
| Munich, DE | 3 | 2007–2009 |