Inventor

John G. Torok

Inventor

Poughkeepsie, NY, US

Overview

1981–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 85 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits25%

G06FElectric digital data processing16%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%

H01RElectrically-conductive connections7%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy6%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%

Y10TTechnical subjects covered by former us classification6%

E04BGeneral building constructions4%

E04FFinishing work on buildings, e.g. stairs, floors4%

G01RMeasuring electric variables3%

PatentTitleYear

11,081,738Containment heatsink for packaged battery cells2021 11,079,827Cognitive battery state of charge recalibration2021 10,978,883Predictive rechargeable battery management system2021 10,972,182Electronically adjustable attenuation wrap plug2021 10,950,831Pressure-induced battery pack venting with filtering2021 10,797,359Cooled containment compartments for packaged battery cells2020 10,739,751Apparatus for facilitating evaluating rechargeable batteries2020 10,714,736Battery pack system with integrated battery disconnect mechanism2020 10,663,486Portable electrical noise probe structure2020 10,660,223Electronics rack door assembly with collapsible acoustical panel2020 10,374,264Cooled containment compartments for packaged battery cells2019 10,374,263Cooled containment compartments for packaged battery cells2019 10,334,748Top-mount cable management structure(s) for an electronics rack2019 10,310,571Cable cassette apparatus2019 10,310,570Cable cassette apparatus2019 10,289,169Cable cassette apparatus2019 10,289,170Cable cassette apparatus2019 10,280,632Load distribution structures for raised floor data center2019 10,280,630Load distribution structures for raised floor data center2019 10,280,631Load distribution structures for raised floor data center2019 10,267,047Load distribution structures for raised floor data center2019 10,228,733Cable cassette apparatus2019 10,161,141Load distribution structures for raised floor data center2018 10,119,278Load distribution structures for raised floor data center2018 10,095,278Cable cassette apparatus2018 10,076,053Screw attachment system for electronic assemblies2018 10,019,028Latch and spring assembly2018 10,019,044Cable cassette apparatus2018 9,921,606'Low-profile swing gate to support service element interface hardware'2018 9,915,682'Non-permanent termination structure for microprobe measurements'2018 9,913,403'Flexible coolant manifoldâ€”heat sink assembly'2018 9,894,807'Changeable, airflow venting cover assembly for an electronics rack'2018 9,740,981'Performing sub-system attribute modification'2017 9,740,980'Performing sub-system attribute modification'2017 9,702,906'Non-permanent termination structure for microprobe measurements'2017 9,665,741'Universal emergency power-off switch security device'2017 9,648,786'Interlock assembly for air-moving assembly'2017 9,629,284'Interlock assembly for air-moving assembly'2017 9,629,279'Low-profile swing gate to support service element interface hardware'2017 9,607,182'Universal emergency power-off switch security device'2017 9,547,334'Latch and spring assembly'2017 9,537,237'System to improve an in-line memory module'2017 9,504,184'Flexible coolant manifold-heat sink assembly'2016 9,442,513'Low-profile swing gate to support service element interface hardware'2016 9,426,924'Screw attachment system for electronic assemblies'2016 9,325,086'Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications'2016 9,052,880'Multi-level interconnect apparatus'2015 8,992,241'Flex circuit blind attachment apparatus and system'2015 8,934,222'Split- and collapsible-top hat frame height reduction features'2015 8,858,250'Electrical cable assembly'2014 8,738,828'System to operationally connect logic nodes'2014 8,713,228'Shared system to operationally connect logic nodes'2014 8,597,032'Electronic assemblies mating system'2013 8,589,608'Logic node connection system'2013 8,582,297'Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics'2013 8,248,805'System to improve an in-line memory module'2012 8,079,481'Integrated frame and central electronic complex structure'2011 7,987,587'Method of forming solid vias in a printed circuit board'2011 7,987,584'Article extraction / insertion tool and assembly'2011 7,913,379'Tool assembly for extracting and installing dual in-line memory module cardlets'2011 7,909,180'Load balancing robust computer frame'2011 7,874,862'Connector actuation mechanism'2011 7,848,109'Assembly and method for ruggedizing computer racks and/or electronic cage assemblies'2010 7,766,684'Connector actuation mechanism'2010 7,710,715'Assembly and method for enhancing structural integrity and improving serviceability of electronic card disposed in a computing environment'2010 7,651,890'Method and apparatus for prevention of solder corrosion'2010 7,505,251'Actuation mechanism for mating electronic card interconnect systems'2009 7,473,102'Space transforming land grid array interposers'2009 7,436,057'Elastomer interposer with voids in a compressive loading system'2008 7,396,244'Apparatus for extracting and inserting a DIMM'2008 7,378,603'Enhanced blind-mated input/output card cassette packaging concept'2008 7,363,688'Land grid array structures and methods for engineering change'2008 7,284,992'Electronic package structures using land grid array interposers for module-to-board interconnection'2007 7,168,958'Wadded-wire LGA contact with parallel solid conductor'2007 7,119,433'Packaging for enhanced thermal and structural performance of electronic chip modules'2006 7,083,477'Providing mechanical support for modular interconnect systems'2006 7,079,381'System and method for aligning and supporting interconnect systems'2006 7,077,660'Land grid array structures and methods for engineering change'2006 6,954,984'Land grid array structure'2005 6,921,272'Method and apparatus for providing positive contact force in an electrical assembly'2005 6,485,311'Compression connector actuation system'2002 6,462,271'Capping structure for electronics package undergoing compressive socket actuation'2002 5,371,320'Spacer-damper'1994 4,740,174'Dead end tension clamp for optical ground wire'1988 4,287,002'Nuclear reactor decontamination'1981

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1981Based in Deep River, CA· patent location history

1988Based in Fishkill, NY, US· patent location history

1994Based in Hopewell Junction, NY, US· patent location history

2002–2021Patents assigned to IBM (82)· patent assignee history

2002–2021Based in Poughkeepsie, NY, US· patent location history

2011–2015Patents assigned to TOROK JOHN G (9)· patent assignee history

2012–2013Patents assigned to EDWARDS DAVID L (2)· patent assignee history

2013–2015Patents assigned to BRODSKY WILLIAM L (5)· patent assignee history

2013–2014Patents assigned to MCKEEVER ERIC J (4)· patent assignee history

2018Based in Pougkeepsie, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	82	2002–2021
TOROK JOHN Gself	9	2011–2015
BRODSKY WILLIAM L	5	2013–2015
MCKEEVER ERIC J	4	2013–2014
EDWARDS DAVID L	2	2012–2013

Locations

Location	Patents	Span
Poughkeepsie, New York, US	81	2002–2021
Pougkeepsie, New York, US	1	2018
Hopewell Junction, New York, US	1	1994
Fishkill, New York, US	1	1988
Deep River, CA	1	1981