Inventor
John L. Colbert
Inventor
Byron, MN, US
Overview
Patents· 42 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H05KPrinted circuits25%
Y10TTechnical subjects covered by former us classification16%
G06FElectric digital data processing11%
H01RElectrically-conductive connections6%
H01LSemiconductor devices3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
G11CStatic stores2%
E05CBolts or fastening devices for wings, specially for doors or windows1%
G01MTesting static or dynamic balance of machines or structures1%
PatentTitleYear
9,456,506'Packaging for eight-socket one-hop SMP topology'20169,445,507'Packaging for eight-socket one-hop SMP topology'20169,265,157'Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint'20168,958,214'Motherboard assembly for interconnecting and distributing signals and power'20158,747,122'Implementing connection of two large electronic boards utilizing LGA interconnect'20148,680,670'Multi-chip module system with removable socketed modules'20148,446,738'Motherboard assembly for interconnecting and distributing signals and power'20138,363,404'Implementing loading and heat removal for hub module assembly'20138,267,701'Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing'20127,985,095'Implementing enhanced connector guide block structures for robust SMT assembly'20117,944,698'Mounting a heat sink in thermal contact with an electronic component'20117,903,411'Cold plate stability'20117,777,329'Heatsink apparatus for applying a specified compressive force to an integrated circuit device'20107,765,693'Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member'20107,751,918'Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates'20107,731,146'Dual swivel in-line load node lock mechanism'20107,701,720'Electronic assembly and techniques for installing a heatsink in an electronic assembly'20107,606,033'Mounting a heat sink in thermal contact with an electronic component'20097,550,840'Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof'20097,517,230'Customizable backer for achieving consistent loading and engagement of array package connections'20097,499,279'Cold plate stability'20097,486,516'Mounting a heat sink in thermal contact with an electronic component'20097,435,622'High performance reworkable heatsink and packaging structure with solder release layer and method of making'20087,399,185'Customizable backer for achieving consistent loading and engagement of array package connections'20087,345,881'Non-influencing fastener for mounting a heat sink in contact with an electronic component'20087,342,306'High performance reworkable heatsink and packaging structure with solder release layer'20087,339,266'Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof'20087,293,994'Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member'20077,071,720'Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit'20066,988,533'Method and apparatus for mounting a heat transfer apparatus upon an electronic component'20066,802,733'Topside installation apparatus for land grid array modules'20046,792,375'Apparatus, system, and method of determining loading characteristics on an integrated circuit module'20046,757,965'Method of installing a land grid array multi-chip modules'20046,634,095'Apparatus for mounting a land grid array module'20036,561,554'Simplified latch and associated assembly method'20036,480,391'Modular cage for an electronic component'20026,475,011'Land grid array socket actuation hardware for MCM applications'20026,449,155'Land grid array subassembly for multichip modules'20026,385,044'Heat pipe heat sink assembly for cooling semiconductor chips'20026,089,917'Method and system for circuit board common mode noise suppression utilizing ferrous cores'20005,947,570'Modular cabinet assembly for a computer'19995,928,016'Direct access storage device housing and tray design'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2016Patents assigned to IBM (42)· patent assignee history
1999–2016Based in Byron, MN, US· patent location history
2012–2015Patents assigned to COLBERT JOHN L (5)· patent assignee history
2012Based in Rochester, MN, US· patent location history
2013–2014Patents assigned to EAGLE JASON R (2)· patent assignee history
2013–2015Patents assigned to SINHA ARVIND K (2)· patent assignee history
2013–2015Patents assigned to WEEKLY ROGER D (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 42 | 1999–2016 |
| COLBERT JOHN Lself | 5 | 2012–2015 |
| EAGLE JASON R | 2 | 2013–2014 |
| SINHA ARVIND K | 2 | 2013–2015 |
| WEEKLY ROGER D | 2 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Byron, Minnesota, US | 41 | 1999–2016 |
| Rochester, Minnesota, US | 1 | 2012 |