Inventor

Florian Longnos

Inventor

Shenzhen, CN

Overview

3→

Patents

2020–2021

Patent span

Performing operations

Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary

G06FElectric digital data processing33%

B29CShaping or joining of plastics17%

B29LIndexing scheme associated with subclass b29c, relating to particular articles17%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering17%

H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers17%

PatentTitleYear

10,997,078Method, apparatus, and non-transitory readable medium for accessing non-volatile memory2021 10,807,301Method and apparatus for manufacturing a mechatronic system by three-dimensional printing2020 10,732,876Memory access technology and computer system2020

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2020–2021Patents assigned to HUAWEI TECH CO LTD (2)· patent assignee history

2020Patents assigned to CENTRE NAT RECH SCIENT (1)· patent assignee history

2020Patents assigned to UNIV PARIS SUD (1)· patent assignee history

2020–2021Based in Shenzhen, CN· patent location history

2020Based in Nieul sur Mer, FR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HUAWEI TECH CO LTD	2	2020–2021
CENTRE NAT RECH SCIENT	1	2020
UNIV PARIS SUD	1	2020

Locations

Location	Patents	Span
Shenzhen, CN	2	2020–2021
Nieul sur Mer, FR	1	2020