Inventor
Kosuke HAREYAMA
Inventor
JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H01LSemiconductor devices20%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation20%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact10%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application10%
H10NElectric solid-state devices not otherwise provided for10%
PatentTitleYear
12,150,383Thermoelectric power generation module and method of manufacturing thermoelectric power generation module202412,132,061Semiconductor device, imaging device, and method of manufacturing semiconductor device202411,942,495Semiconductor device, imaging apparatus, and method for manufacturing semiconductor device2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (3)· patent assignee history
2024Patents assigned to SONY GROUP CORP (1)· patent assignee history
2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY SEMICONDUCTOR SOLUTIONS CORP | 3 | 2024 |
| SONY GROUP CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 3 | 2024 |