Inventor
Jean Dery
Inventor
Granby, CA
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests30%
G06FElectric digital data processing10%
G07BTicket-issuing apparatus10%
PatentTitleYear
6,618,797'Device and method for protection against stack overflow and franking machine using same'20036,410,988'Thermally enhanced and mechanically balanced flip chip package and method of forming'20026,348,738'Flip chip assembly'20026,306,683'Method of forming a flip chip assembly, and a flip chip assembly formed by the method'20016,104,093'Thermally enhanced and mechanically balanced flip chip package and method of forming'20006,074,895'Method of forming a flip chip assembly'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2002Patents assigned to IBM (5)· patent assignee history
2000–2002Based in Granby, CA· patent location history
2003Patents assigned to ASCOM AUTELCA AG (1)· patent assignee history
2003Patents assigned to SECAP (1)· patent assignee history
2003Based in Asnieres, FR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 5 | 2000–2002 |
| ASCOM AUTELCA AG | 1 | 2003 |
| SECAP | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Granby, CA | 5 | 2000–2002 |
| Asnieres, FR | 1 | 2003 |