Inventor
SHRIPAD GOKHALE
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
PatentTitleYear
12,417,958Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone202512,394,773Laser ablation-based surface property modification and contamination removal202512,362,340Laser ablation-based surface property modification and contamination removal202512,347,743Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone202512,315,777Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025Patents assigned to INTEL CORP (5)· patent assignee history
2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2025 |