Inventor
Patrick Alan Loney
Inventor
Fairview Park, OH, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10NElectric solid-state devices not otherwise provided for25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H05KPrinted circuits10%
H10DInorganic electric semiconductor devices10%
H01FMagnets5%
PatentTitleYear
10,727,162Integrated circuit having a heat sink coupled to separate ground planes through vias with different thermal characteristics202010,644,218Multichip device with temperature isolating bump bonds202010,629,535Thermally isolated ground planes with a superconducting electrical coupler202010,290,676Superconducting device with thermally conductive heat sink201910,229,864Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2020Patents assigned to NORTHROP GRUMMAN SYSTEMS CORP (5)· patent assignee history
2019–2020Patents assigned to HATHAWAY AARON ASHLEY (2)· patent assignee history
2019–2020Patents assigned to LONEY PATRICK ALAN (2)· patent assignee history
2019–2020Patents assigned to YOUNG ROBERT MILES (2)· patent assignee history
2019–2020Based in Fairview Park, OH, US· patent location history
2020Patents assigned to HACKLEY JUSTIN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NORTHROP GRUMMAN SYSTEMS CORP | 5 | 2019–2020 |
| HATHAWAY AARON ASHLEY | 2 | 2019–2020 |
| LONEY PATRICK ALANself | 2 | 2019–2020 |
| YOUNG ROBERT MILES | 2 | 2019–2020 |
| HACKLEY JUSTIN | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fairview Park, OH, US | 5 | 2019–2020 |