Inventor

Yoichiro Kurita

Inventor

Kanagawa, JP

Overview

2004–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 88 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%

H01LSemiconductor devices13%

H05KPrinted circuits10%

B23KSoldering or unsoldering3%

Y10TTechnical subjects covered by former us classification2%

G02BOptical elements, systems or apparatus2%

G11CStatic stores2%

G06NComputing arrangements based on specific computational models1%

H10DInorganic electric semiconductor devices1%

PatentTitleYear

11,062,174Mobile entity detection apparatus, mobile entity detection method, and computer-readable recording medium2021 11,018,112Bonding method of semiconductor chip and bonding apparatus of semiconductor chip2021 10,991,673Electronic device2021 10,879,227Electronic device2020 10,847,497Bonding method of semiconductor chip and bonding apparatus of semiconductor chip2020 10,672,750Semiconductor device2020 10,658,338Semiconductor device including a re-interconnection layer and method for manufacturing same2020 10,580,763Electronic device2020 10,566,219Chip transfer member, chip transfer apparatus, and chip transfer method2020 10,510,725Semiconductor device2019 10,497,688Semiconductor device having stacked logic and memory chips2019 10,475,767Electronic device2019 10,429,598Optical device and optical coupling module2019 10,396,060Semiconductor device and method for manufacturing same2019 10,373,929Method of manufacturing a semiconductor device2019 10,224,318Electronic device2019 10,203,460Optical semiconductor module2019 10,128,223Semiconductor device and manufacturing method thereof2018 10,096,574Semiconductor device including protective film over a substrate2018 10,032,758Method of manufacturing semiconductor device2018 9,972,600Semiconductor device including protective film over a substrate2018 9,847,325Electronic device2017 9,728,519'Bonding method of semiconductor chip and bonding apparatus of semiconductor chip'2017 9,721,935'Semiconductor device and manufacturing method thereof'2017 9,595,507'Semiconductor device and method of manufacturing the same'2017 9,524,953'Electronic device'2016 9,406,602'Electronic device'2016 9,396,998'Semiconductor device having fan-in and fan-out redistribution layers'2016 9,324,699'Semiconductor device'2016 8,975,750'Electronic device'2015 8,916,976'Semiconductor device and method of manufacturing the same'2014 8,890,305'Semiconductor device'2014 8,823,174'Electronic device'2014 8,685,796'Electronic device and method of manufacturing the same'2014 8,633,591'Electronic device'2014 8,552,570'Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device'2013 8,541,874'Semiconductor device'2013 8,456,020'Semiconductor package and method of manufacturing the same'2013 8,395,269'Method of stacking semiconductor chips including forming an interconnect member and a through electrode'2013 8,354,340'Electronic device and method of manufacturing the same'2013 8,349,649'Semiconductor device and manufacturing method thereof'2013 8,304,870'Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device'2012 8,278,143'Manufacturing method for electronic devices'2012 8,207,605'Semiconductor device having a sealing resin and method of manufacturing the same'2012 8,193,033'Semiconductor device having a sealing resin and method of manufacturing the same'2012 8,114,766'Method for manufacturing semiconductor device'2012 8,058,165'Semiconductor device and method of manufacturing the same'2011 8,050,050'Wiring board, semiconductor device, and method of manufacturing the same'2011 8,039,969'Semiconductor device'2011 8,039,756'Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same'2011 8,035,231'Semiconductor device and method of manufacturing the same'2011 8,030,201'Semiconductor device and method of manufacturing the same'2011 7,977,158'Manufacturing method for electronic devices'2011 7,931,411'Optical transmission apparatus to which optical cable is connected'2011 7,928,001'Electronic device and method of manufacturing the same'2011 7,927,999'Method of forming metal interconnect layers for flip chip device'2011 7,889,514'Wiring board, semiconductor device, and method of manufacturing the same'2011 7,880,295'Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same'2011 7,812,446'Semiconductor device'2010 7,812,457'Semiconductor device and semiconductor wafer and a method for manufacturing the same'2010 7,800,233'Semiconductor device and method of manufacturing the same'2010 7,795,721'Semiconductor device and method for manufacturing the same'2010 7,791,186'Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same'2010 7,772,032'Manufacturing method for electronic devices'2010 7,763,985'Flip-chip type semiconductor device'2010 7,759,786'Electronic circuit chip, and electronic circuit device and method for manufacturing the same'2010 7,667,312'Semiconductor device including a heat-transmitting and electromagnetic-noise-blocking substance and method of manufacturing the same'2010 7,663,244'Semiconductor device and semiconductor wafer and a method for manufacturing the same'2010 7,656,046'Semiconductor device'2010 7,652,375'Semiconductor device and method of manufacturing the same'2010 7,622,801'Thin planar semiconductor device'2009 7,598,117'Method for manufacturing semiconductor module using interconnection structure'2009 7,598,590'Semiconductor chip and method for manufacturing the same and semiconductor device'2009 7,592,692'Semiconductor device with a dummy electrode'2009 7,556,983'Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same'2009 7,554,205'Flip-chip type semiconductor device'2009 7,538,022'Method of manufacturing electronic circuit device'2009 7,495,345'Semiconductor device-composing substrate and semiconductor device'2009 7,370,786'Bonding method and bonding apparatus'2008 7,262,486'SOI substrate and method for manufacturing the same'2007 7,238,548'Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device'2007 7,034,386'Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same'2006 6,932,262'Bonding method and bonding apparatus'2005 6,930,396'Semiconductor device and method for manufacturing the same'2005 6,822,336'Semiconductor device'2004 6,814,274'Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method'2004 6,753,238'Semiconductor device and manufacturing method thereof'2004 6,740,811'Electric terminal for an electronic device'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2011Patents assigned to NEC ELECTRONICS CORP (29)· patent assignee history

2004–2016Based in Kanagawa, JP· patent location history

2004–2021Based in Tokyo, JP· patent location history

2006–2011Patents assigned to NEC CORP (9)· patent assignee history

2007–2014Based in Kawasaki, JP· patent location history

2011–2020Patents assigned to RENESAS ELECTRONICS CORP (35)· patent assignee history

2011–2014Patents assigned to KURITA YOICHIRO (14)· patent assignee history

2016–2021Patents assigned to TOSHIBA KK (12)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
RENESAS ELECTRONICS CORP	35	2011–2020
NEC ELECTRONICS CORP	29	2004–2011
KURITA YOICHIROself	14	2011–2014
TOSHIBA KK	12	2016–2021
NEC CORP	9	2006–2011

Locations

Location	Patents	Span
Kanagawa, JP	48	2004–2016
Tokyo, JP	33	2004–2021
Kawasaki, JP	7	2007–2014