Inventor
Kevin Moran
Inventor
Wappingers Falls, NY, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
G06FElectric digital data processing13%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application9%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for4%
B60TVehicle brake control systems or parts thereof4%
B60WConjoint control of vehicle sub-units of different type or different function4%
F16LPipes4%
G01TMeasurement of nuclear or x-radiation4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
PatentTitleYear
11,099,731Techniques for content management using a gesture sensitive element202110,948,614Imaging system with one or more mask units and corresponding method of recording radiation202110,899,360Method and system for vehicle ESC system using map data2021D0899433Display screen or portion thereof with animated graphical user interface202010,699,729Phase inversion for virtual assistants and mobile music apps202010,430,064Techniques for utilizing translucent user interface elements201910,379,725Techniques for utilizing translucent user interface elements201910,083,106Computer aided bug reporting system for GUI applications20186,328,345'Secondary tubing containment system for a metering pump'20015,902,016'Child restraint harness clip'19995,323,293'Arrangement for placing central processors and memory in a cryo cooled chamber'19945,228,502'Cooling by use of multiple parallel convective surfaces'19935,177,667'Thermal conduction module with integral impingement cooling'19935,016,090'Cross-hatch flow distribution and applications thereof'19915,005,638'Thermal conduction module with barrel shaped piston for improved heat transfer'19914,050,507'Method for customizing nucleate boiling heat transfer from electronic units immersed in dielectric coolant'1977Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1977–1994Patents assigned to IBM (6)· patent assignee history
1977–1994Based in Wappingers Falls, NY, US· patent location history
2018Patents assigned to COLLEGE OF WILLIAM & MARY (1)· patent assignee history
2018Patents assigned to COLLEGE WILLIAM & MARY (1)· patent assignee history
2018Based in Williamsburg, VA, US· patent location history
2019–2021Patents assigned to AMAZON TECH INC (4)· patent assignee history
2019–2021Based in San Francisco, CA, US· patent location history
2021Patents assigned to H3D INC (1)· patent assignee history
2021Based in South Lyon, MI, US· patent location history
2021Based in West Dundee, IL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 6 | 1977–1994 |
| AMAZON TECH INC | 4 | 2019–2021 |
| COLLEGE OF WILLIAM & MARY | 1 | 2018 |
| COLLEGE WILLIAM & MARY | 1 | 2018 |
| H3D INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 6 | 1977–1994 |
| San Francisco, California, US | 5 | 2019–2021 |
| South Lyon, MI, US | 1 | 2021 |
| West Dundee, Illinois, US | 1 | 2021 |
| Williamsburg, Virginia, US | 1 | 2018 |