Inventor
FARRELL M. GOOD
Inventor
US
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices23%
H01LSemiconductor devices20%
H10NElectric solid-state devices not otherwise provided for17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
C23CCoating metallic material9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
C01BNon-metallic elements6%
H10DInorganic electric semiconductor devices3%
H10KOrganic electric solid-state devices3%
PatentTitleYear
12,432,984Microelectronic devices including stack structures having doped interfacial regions, and related systems and methods202512,027,363Methods of forming electronic devices comprising silicon carbide materials202411,980,108Protective sealant for chalcogenide material and methods for forming the same202411,551,926Methods of forming a microelectronic device, and related systems and additional methods202311,527,716Memory device with boron nitride liner202211,444,243Electronic devices comprising metal oxide materials and related methods and systems202211,424,118Electronic devices comprising silicon carbide materials202211,417,840Protective sealant for chalcogenide material and methods for forming the same202211,404,267Semiconductor structure formation2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to MICRON TECHNOLOGY INC (8)· patent assignee history
2022Patents assigned to INTEL CORP (1)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 8 | 2022–2025 |
| INTEL CORP | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 9 | 2022–2025 |