Inventor

Hiroyuki Kurimura

Inventor
Shibukawa, JP

Overview

19→
Patents
2008–2019
Patent span
Chemistry
Primary field (CPC C)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B32Bprimary
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form14%
Y10TTechnical subjects covered by former us classification14%
C09JAdhesives13%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds11%
C08LCompositions of macromolecular compounds11%
C03CChemical composition of glasses, glazes or vitreous enamels7%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein7%
C03BManufacture, shaping, or supplementary processes3%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
PatentTitleYear
10,434,617Method of producing display panels20199,844,858Flat-plate bonding jig and method of manufacturing flat-plate laminated body20179,718,996'Composition and method for temporarily fixing member using same'20179,643,221'Ultrasonic cleaning method and apparatus'20179,381,727'Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus'20169,358,763'Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus'20169,242,442'Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus'20169,227,385'Method for processing transluscent rigid substrate laminate and method for manufacturing plate shaped product'20169,067,398'Method for disassembling bonded body, and adhesive'20159,061,485'Method of manufacturing translucent rigid substrate laminate'20159,023,173'Method of processing translucent rigid substrate laminate, and process of manufacturing plate-shaped product employing the method'20158,901,192'(Meth)acrylic resin composition'20148,845,858'Method for separating bonded bodies using excimer light irradiation'20148,673,105'Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus'20148,048,258'Resin composition, and temporary fixing method and surface protecting method for members to be processed, by means thereof'20117,988,811'Adhesive composition and method for temporarily fixing member by using the same'20117,977,428'Linear block copolymer composition'20117,714,067'Block copolymer mixture containing star-branched block copolymer'20107,393,898'Block copolymer composition'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2015Patents assigned to DENKI KAGAKU KOGYO KK (11)· patent assignee history
2008Based in Machida, JP· patent location history
2010–2011Based in Tokyo, JP· patent location history
2011–2019Based in Shibukawa, JP· patent location history
2014–2017Patents assigned to KURIMURA HIROYUKI (13)· patent assignee history
2014–2016Patents assigned to MIYAZAKI HAYATO (5)· patent assignee history
2014–2015Patents assigned to ICHIKAWA ISAMU (4)· patent assignee history
2016–2019Patents assigned to DENKA COMPANY LTD (8)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KURIMURA HIROYUKIself132014–2017
DENKI KAGAKU KOGYO KK112008–2015
DENKA COMPANY LTD82016–2019
MIYAZAKI HAYATO52014–2016
ICHIKAWA ISAMU42014–2015
Locations
LocationPatentsSpan
Shibukawa, JP162011–2019
Tokyo, JP22010–2011
Machida, JP12008