Inventor
TAKAHIRO NONAKA
Inventor
JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Jprimary
C09JAdhesives21%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form11%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds11%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds11%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C08LCompositions of macromolecular compounds5%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
G02BOptical elements, systems or apparatus5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
G06FElectric digital data processing5%
PatentTitleYear
12,571,953Polarizing film having pressure-sensitive adhesive layer with specified saturated moisture content202612,398,296Method for producing pressure-sensitive adhesive sheet, and pressure-sensitive adhesive sheet202511,744,164Resistive random access memory device and method for manufacturing the same202311,319,462Pressure sensitive adhesive sheet, method for manufacturing thereof, and pressure sensitive adhesive film202211,319,470Pressure sensitive adhesive, curable pressure sensitive adhesive composition, pressure sensitive adhesive sheet and method for manufacturing thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to NITTO DENKO CORP (4)· patent assignee history
2022–2026Based in JP· patent location history
2023Patents assigned to KIOXIA CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 4 | 2022–2026 |
| KIOXIA CORP | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 5 | 2022–2026 |