Inventor

Tetsuo Okura

Inventor

Settsu, JP

Overview

2→

Patents

2016–2021

Patent span

Chemistry

Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary

B29CShaping or joining of plastics13%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts13%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds13%

C08JWorking-up13%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%

C08LCompositions of macromolecular compounds13%

H03FAmplifiers13%

H03MCoding13%

PatentTitleYear

11,053,386Poly(3-hydroxyalkanoate) resin composition2021 9,306,589'Analog-digital conversion system and method for controlling the same'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to CYPRESS SEMICONDCUTOR CORP (1)· patent assignee history

2016Patents assigned to SPANSION LLC (1)· patent assignee history

2016Based in Kanagaw, JP· patent location history

2021Patents assigned to KANEKA CORP (1)· patent assignee history

2021Based in Settsu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
CYPRESS SEMICONDCUTOR CORP	1	2016
KANEKA CORP	1	2021
SPANSION LLC	1	2016

Locations

Location	Patents	Span
Settsu, JP	1	2021
Kanagaw, JP	1	2016