Inventor
Yongna LI
Inventor
CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10BElectronic memory devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10DInorganic electric semiconductor devices11%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use6%
PatentTitleYear
12,490,440Three-dimensional memory devices and fabricating methods thereof202512,142,575Staircase etch control in forming three-dimensional memory device202412,137,567Interconnect structure of three-dimensional memory device202411,991,880Three-dimensional memory devices and fabricating methods thereof2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2025Patents assigned to YANGTZE MEMORY TECH CO LTD (4)· patent assignee history
2024Patents assigned to YANGTZA MEMORY TECH CO LTD (1)· patent assignee history
2024–2025Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| YANGTZE MEMORY TECH CO LTD | 4 | 2024–2025 |
| YANGTZA MEMORY TECH CO LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 4 | 2024–2025 |