Inventor
Chun-sheng LU
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10BElectronic memory devices26%
H10DInorganic electric semiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
11,972,972Isolation structure and manufacturing method thereof202411,908,953Manufacturing method of memory device202411,575,051Memory device and manufacturing method thereof202311,538,818Manufacturing method for memory structure202211,398,383Semiconductor structure and method for forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to WINBOND ELECTRONICS CORP (5)· patent assignee history
2022–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| WINBOND ELECTRONICS CORP | 5 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2022–2024 |