Inventor
Sarah Haney
Inventor
Cary, NC, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
H01LSemiconductor devices14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H05KPrinted circuits10%
H10DInorganic electric semiconductor devices10%
G05DSystems for controlling or regulating non-electric variables4%
Y10TTechnical subjects covered by former us classification4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock2%
PatentTitleYear
10,827,617Printed circuit board with cavity202010,271,421Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module201910,179,729Hermetic encapsulation for microelectromechanical systems (MEMS) devices201910,068,834Floating bond pad for power semiconductor devices201810,033,093mmWave antennas and transmission lines on standard substrate materials20189,997,428Via structures for thermal dissipation20189,974,181Module with external shield and back-spill barrier for protecting contact pads20189,791,470'Magnet placement for integrated sensor packages'20179,505,610'Device, system and method for providing MEMS structures of a semiconductor package'20169,501,068'Integration of pressure sensors into integrated circuit fabrication and packaging'20169,345,184'Magnetic field shielding for packaging build-up architectures'20169,312,256'Bidirectional silicon carbide transient voltage supression devices'20169,260,294'Integration of pressure or inertial sensors into integrated circuit fabrication and packaging'20169,242,854'Hermetic encapsulation for microelectromechanical systems (MEMS) devices'20168,445,917'Bidirectional silicon carbide transient voltage suppression devices'20137,795,691'Semiconductor transistor with P type re-grown channel layer'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2018Patents assigned to CREE INC (4)· patent assignee history
2010Based in Apex, NC, US· patent location history
2013–2019Based in Cary, NC, US· patent location history
2016–2019Patents assigned to INTEL CORP (8)· patent assignee history
2016Patents assigned to EID FERAS (1)· patent assignee history
2018–2019Patents assigned to AVAGO TECHNOLOGIES GENERAL IP (3)· patent assignee history
2018–2020Based in San Jose, CA, US· patent location history
2019–2020Patents assigned to AVAGO TECH INT SALES PTE LID (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2016–2019 |
| CREE INC | 4 | 2010–2018 |
| AVAGO TECHNOLOGIES GENERAL IP | 3 | 2018–2019 |
| AVAGO TECH INT SALES PTE LID | 2 | 2019–2020 |
| EID FERAS | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cary, NC, US | 11 | 2013–2019 |
| San Jose, California, US | 4 | 2018–2020 |
| Apex, NC, US | 1 | 2010 |