Inventor
Kenzou Hatada
Inventor
Osaka, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Rprimary
G01RMeasuring electric variables60%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification20%
PatentTitleYear
6,323,663'Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method'20016,005,401'Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method'19995,945,834'Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method'19995,037,780'Method for attaching semiconductors to a transparent substrate using a light-curable resin'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2001Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (4)· patent assignee history
1991Based in Katano, JP· patent location history
1999–2001Based in Osaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 4 | 1991–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 3 | 1999–2001 |
| Katano, JP | 1 | 1991 |