Inventor
Boning Wang
Inventor
Beijing, CN
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing22%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables11%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein11%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes11%
G09GArrangements or circuits for control of indicating devices using static means to present variable information11%
H01LSemiconductor devices11%
H05KPrinted circuits11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2020Patents assigned to BOE TECHNOLOGY GROUP CO LTD (2)· patent assignee history
2018Patents assigned to BEIJING BOE DISPLAY TECH CO (1)· patent assignee history
2018–2020Based in Beijing, CN· patent location history
2020Patents assigned to BEIJING BOE OPTOELECTRONICS TECH CO LTD (1)· patent assignee history
2021Patents assigned to YIELDMO INC (1)· patent assignee history
2021Based in New York, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BOE TECHNOLOGY GROUP CO LTD | 2 | 2018–2020 |
| BEIJING BOE DISPLAY TECH CO | 1 | 2018 |
| BEIJING BOE OPTOELECTRONICS TECH CO LTD | 1 | 2020 |
| YIELDMO INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 2 | 2018–2020 |
| New York, New York, US | 1 | 2021 |