Inventor
Yasufumi Matsuoka
Inventor
Kyoto, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H10DInorganic electric semiconductor devices15%
B23KSoldering or unsoldering5%
PatentTitleYear
10,535,624Semiconductor device and semiconductor device mounting structure having conductor plates202010,312,171Semiconductor device20199,859,182'Semiconductor device'20189,711,481'Semiconductor device and semiconductor device mounting structure'20179,490,194'Semiconductor device'20169,379,085'Wire bonding structure of semiconductor device and wire bonding method'20169,236,317'Semiconductor device'20168,963,304'Semiconductor device and semiconductor device mounting structure'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2020Patents assigned to ROHM CO LTD (8)· patent assignee history
2015–2016Patents assigned to MATSUOKA YASUFUMI (2)· patent assignee history
2015–2020Based in Kyoto, JP· patent location history
2016Patents assigned to Tsubaki ryuji (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ROHM CO LTD | 8 | 2015–2020 |
| MATSUOKA YASUFUMIself | 2 | 2015–2016 |
| Tsubaki ryuji | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 8 | 2015–2020 |