Inventor
Jun Ookura
Inventor
Suwa, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1045%
B05DProcesses for applying fluent materials to surfaces, in general13%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
G05BControl or regulating systems in general10%
G05DSystems for controlling or regulating non-electric variables6%
B05BSpraying apparatus3%
B05CApparatus for applying fluent materials to surfaces, in general3%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
7,868,270'Temperature control for performing heat process in coating/developing system for resist film'20117,755,003'Temperature control for performing heat process on resist film'20107,510,611'Coating film forming method and apparatus'20097,488,505'Coating film forming method and system'20096,973,370'Substrate processing apparatus and method for adjusting a substrate transfer position'20056,884,294'Coating film forming method and apparatus'20056,776,845'Coating film forming method and system'20046,686,571'Heat treatment unit, cooling unit and cooling treatment method'20046,654,668'Processing apparatus, processing system, distinguishing method, and detecting method'20036,644,965'Substrate processing apparatus and substrate processing method'20036,620,245'Liquid coating apparatus with temperature controlling manifold'20036,507,770'Substrate processing system and substrate processing method'20036,461,438'Heat treatment unit, cooling unit and cooling treatment method'20026,402,509'Substrate processing apparatus and substrate processing method'20026,332,751'Transfer device centering method and substrate processing apparatus'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2011Patents assigned to TOKYO ELECTRON LTD (15)· patent assignee history
2001–2003Based in Kumamoto, JP· patent location history
2002–2009Based in Suwa, JP· patent location history
2002–2004Based in Kikuchi-gun, JP· patent location history
2010–2011Based in Koshi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 15 | 2001–2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwa, JP | 7 | 2002–2009 |
| Kumamoto, JP | 4 | 2001–2003 |
| Koshi, JP | 2 | 2010–2011 |
| Kikuchi-gun, JP | 2 | 2002–2004 |