Inventor
Yuji Kunimoto
Inventor
Nagano, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
Y10TTechnical subjects covered by former us classification14%
H01LSemiconductor devices13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers3%
Y02PClimate change mitigation technologies in the production or processing of goods3%
A21CMachines or equipment for making or processing doughs1%
A21DTreatment of flour or dough for baking, e.g. by addition of materials1%
H01RElectrically-conductive connections1%
PatentTitleYear
10,477,703Wiring board201910,134,680Electronic part embedded substrate and method of producing an electronic part embedded substrate20189,824,963'Wiring board, and semiconductor device'20179,768,122'Electronic part embedded substrate and method of producing an electronic part embedded substrate'20179,736,941'Wiring substrate'20179,646,926'Wiring substrate and method of manufacturing the same'20179,451,702'Chip embedded substrate and method of producing the same'20169,412,687'Wiring substrate and method of manufacturing the same'20169,332,658'Wiring board, semiconductor device, and method for manufacturing wiring board'20169,198,290'Wiring substrate, method of manufacturing the same, and semiconductor device'20158,941,230'Semiconductor package and manufacturing method'20158,907,489'Wiring substrate, method of manufacturing the same, and semiconductor device'20148,793,868'Chip embedded substrate and method of producing the same'20148,736,073'Semiconductor device'20148,530,753'Fine wiring package and method of manufacturing the same'20138,410,614'Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same'20138,399,977'Resin-sealed package and method of producing the same'20138,318,543'Method of manufacturing semiconductor device'20128,314,347'Wiring board with lead pins and method of producing the same'20128,110,921'Semiconductor package and method of manufacturing the same'20127,989,707'Chip embedded substrate and method of producing the same'20117,598,608'Mounting substrate'20095,084,288'Premix for cooking by a microwave oven and process of preparation thereof'19924,818,545'Food material-container combination'19894,705,209'Erectable container'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–1992Patents assigned to HOUSE FOOD INDUSTRIAL CO (3)· patent assignee history
1987Based in Kobe, JP· patent location history
1989Based in Koube, JP· patent location history
1992Based in Hyogo, JP· patent location history
2009–2019Patents assigned to SHINKO ELECTRIC IND CO (22)· patent assignee history
2009–2019Based in Nagano, JP· patent location history
2012–2014Patents assigned to KUNIMOTO YUJI (8)· patent assignee history
2012–2013Patents assigned to TATEIWA AKIHIKO (3)· patent assignee history
2014Patents assigned to ARAI TADASHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 22 | 2009–2019 |
| KUNIMOTO YUJIself | 8 | 2012–2014 |
| HOUSE FOOD INDUSTRIAL CO | 3 | 1987–1992 |
| TATEIWA AKIHIKO | 3 | 2012–2013 |
| ARAI TADASHI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 22 | 2009–2019 |
| Hyogo, JP | 1 | 1992 |
| Koube, JP | 1 | 1989 |
| Kobe, JP | 1 | 1987 |