Inventor
Yukiharu Takeuchi
Inventor
Nagano, JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
Y10TTechnical subjects covered by former us classification16%
H05KPrinted circuits11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles3%
F16LPipes3%
H01LSemiconductor devices3%
B23KSoldering or unsoldering1%
B29CShaping or joining of plastics1%
PatentTitleYear
10,006,565Fuel supply apparatus20189,490,221'Semiconductor device having multiple magnetic shield members'20168,853,841'Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same'20148,729,680'Semiconductor device'20148,525,355'Semiconductor device, electronic apparatus and semiconductor device fabricating method'20138,402,644'Method of manufacturing an electronic parts packaging structure'20138,373,997'Semiconductor device'20138,191,568'Fuel tank for motor vehicle'20128,053,677'Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same'20117,843,059'Electronic parts packaging structure'20107,816,177'Semiconductor device and method of manufacturing the same'20107,791,206'Semiconductor device and method of manufacturing the same'20107,788,061'Substrate and mask aligning apparatus'20107,723,838'Package structure having semiconductor device embedded within wiring board'20107,279,771'Wiring board mounting a capacitor'20076,534,846'Lead frame for semiconductor device and semiconductor device using same'20036,429,517'Semiconductor device and fabrication method thereof'20026,271,478'Multi-layer circuit board'20016,221,749'Semiconductor device and production thereof'20016,194,668'Multi-layer circuit board'20016,093,476'Wiring substrate having vias'20005,997,999'Sintered body for manufacturing ceramic substrate'19995,983,950'Hose structure and method of manufacturing the same'19995,919,546'Porous ceramic impregnated wiring body'19995,744,224'Board for mounting semiconductor chip'19985,733,640'Fired body for manufacturing a substrate'19985,497,030'Lead frame and resin-molded-type semiconductor device'19965,229,213'Aluminum nitride circuit board'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2016Patents assigned to SHINKO ELECTRIC IND CO (25)· patent assignee history
1993–2016Based in Nagano, JP· patent location history
1999–2018Patents assigned to TOYODA GOSEI KK (3)· patent assignee history
1999Based in Inazawa, JP· patent location history
2012–2013Patents assigned to TAKEUCHI YUKIHARU (4)· patent assignee history
2012Based in Aichi, JP· patent location history
2013Patents assigned to GOMYO TOSHIO (2)· patent assignee history
2013Patents assigned to TAKAYANAGI HIDENORI (2)· patent assignee history
2018Based in Kiyosu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 25 | 1993–2016 |
| TAKEUCHI YUKIHARUself | 4 | 2012–2013 |
| TOYODA GOSEI KK | 3 | 1999–2018 |
| GOMYO TOSHIO | 2 | 2013 |
| TAKAYANAGI HIDENORI | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 25 | 1993–2016 |
| Kiyosu, JP | 1 | 2018 |
| Aichi, JP | 1 | 2012 |
| Inazawa, JP | 1 | 1999 |