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Inventor

Akira Takeishi

Inventor
Tokyo, JP

Overview

3→
Patents
1989–2003
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering20%
B24BMachines, devices, or processes for grinding or polishing20%
B64FGround or aircraft-carrier-deck installations specially adapted for use in connection with aircraft20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests20%
PatentTitleYear
6,516,991'Wire bonding apparatus'20036,425,801'Polishing process monitoring method and apparatus, its endpoint detection method, and polishing machine using same'20024,885,816'Rotating-brush washing apparatus'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989Patents assigned to JAPAN AIRLINES CO (1)· patent assignee history
1989Patents assigned to KAWASAKI HEAVY IND LTD (1)· patent assignee history
1989Based in Yokohama, JP· patent location history
2002–2003Patents assigned to NEC CORP (2)· patent assignee history
2002–2003Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NEC CORP22002–2003
JAPAN AIRLINES CO11989
KAWASAKI HEAVY IND LTD11989
Locations
LocationPatentsSpan
Tokyo, JP22002–2003
Yokohama, JP11989