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Inventor

Katuhiko Murakawa

Inventor
Obu, JP

Overview

7→
Patents
1988–1999
Patent span
Chemistry
Primary field (CPC C)

Patents· 7 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material88%
H05KPrinted circuits13%
PatentTitleYear
5,965,211'Electroless copper plating solution and process for formation of copper film'19995,039,338'Electroless copper plating solution and process for formation of copper film'19914,956,014'Electroless copper plating solution'19904,935,267'Process for electrolessly plating copper and plating solution therefor'19904,834,796'Electroless copper plating solution and process for electrolessly plating copper'19894,814,009'Electroless copper plating solution'19894,790,876'Chemical copper-blating bath'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988–1999Patents assigned to NIPPON DENSO CO (7)· patent assignee history
1988–1990Based in Obu, JP· patent location history
1991–1999Based in Toyota, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NIPPON DENSO CO71988–1999
Locations
LocationPatentsSpan
Obu, JP51988–1990
Toyota, JP21991–1999