Inventor
Yuji Okuda
Inventor
Toyota, JP
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B60Wprimary
B60WConjoint control of vehicle sub-units of different type or different function20%
B62DMotor vehicles15%
G08GTraffic control systems8%
B24BMachines, devices, or processes for grinding or polishing7%
B24CAbrasive or related blasting with particulate material5%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles3%
B60YIndexing scheme relating to aspects cross-cutting vehicle technology3%
G06FElectric digital data processing3%
G08BSignalling systems, e.g. personal calling systems3%
PatentTitleYear
10,839,692Driving supporter202010,780,916Lane departure suppression device202010,767,994Sensor output correction apparatus202010,644,614Conversion device having a control unit for detecting arm short-circuit202010,562,568Vehicle control device202010,137,250Syringe and prefilled syringe201810,081,358Lane departure prevention apparatus201810,081,389Driving support apparatus for vehicle201810,065,679Driving support device for vehicle20189,994,253Lane keeping assist apparatus20189,956,990Lane keeping assist apparatus20189,862,415'Lane keeping assist apparatus'20189,834,213Lane keeping assist apparatus20179,805,275'Drift-assessment device'20179,597,960'Driving assistance device'20179,477,095'Eyeglasses'20169,409,478'Sway determination device and sway determination method'20169,315,194'Low-level consciousness determination system'20168,795,491'Method of processing sensor element and sensor element'20148,480,870'Sensor element and gas sensor'20138,226,784'Method of forming laminated body and method of manufacturing sensor element'20128,086,372'Steering support device'20117,040,963'Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer'20067,029,379'Wafer holding plate for wafer grinding apparatus and method for manufacturing the same'20066,916,228'Wafer holding plate for wafer grinding apparatus and method for manufacturing the same'20056,475,068'Wafer holding plate for wafer grinding apparatus and method for manufacturing the same'2002RE036646'Speech coding system utilizing a recursive computation technique for improvement in processing speed'20005,991,872'Processor'19995,978,925'System for improving processing efficiency in a pipeline by delaying a clock signal to a program counter and an instruction memory behind a system clock'19995,400,399'Speech communication apparatus equipped with echo canceller'19955,230,036'Speech coding system utilizing a recursive computation technique for improvement in processing speed'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2000Patents assigned to TOSHIBA KK (5)· patent assignee history
1993–2000Based in Tokyo, JP· patent location history
2002–2006Patents assigned to IBIDEN CO LTD (4)· patent assignee history
2002–2006Based in Gifu, JP· patent location history
2011–2020Patents assigned to TOYOTA MOTOR CO LTD (15)· patent assignee history
2011–2017Patents assigned to OKUDA YUJI (8)· patent assignee history
2011–2017Based in Susono, JP· patent location history
2017–2020Based in Toyota, JP· patent location history
2018–2020Patents assigned to DENSO CORP (3)· patent assignee history
2018–2020Based in Okazaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYOTA MOTOR CO LTD | 15 | 2011–2020 |
| OKUDA YUJIself | 8 | 2011–2017 |
| TOSHIBA KK | 5 | 1993–2000 |
| IBIDEN CO LTD | 4 | 2002–2006 |
| DENSO CORP | 3 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyota, JP | 6 | 2017–2020 |
| Okazaki, JP | 5 | 2018–2020 |
| Susono, JP | 5 | 2011–2017 |
| Gifu, JP | 4 | 2002–2006 |
| Tokyo, JP | 4 | 1993–2000 |