Inventor
Hamid Noorbakhsh
Inventor
Fremont, CA, US
Overview
Patents· 46 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Jprimary
H01JElectric discharge tubes or discharge lamps28%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C23CCoating metallic material14%
H01LSemiconductor devices9%
B05BSpraying apparatus4%
Y10TTechnical subjects covered by former us classification4%
G05BControl or regulating systems in general3%
H05HPlasma technique3%
G05DSystems for controlling or regulating non-electric variables2%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%
PatentTitleYear
11,130,142Showerhead having a detachable gas distribution plate202110,954,595High power showerhead with recursive gas flow distribution202110,943,808Ceramic electrostatic chuck having a V-shape seal band202110,930,540Electrostatic chuck assembly having a dielectric filler202110,886,107Extended detachable gas distribution plate and showerhead incorporating same202110,854,425Feedforward temperature control for plasma processing apparatus202010,847,347Edge ring assembly for a substrate support in a plasma processing chamber202010,790,120Showerhead having a detachable high resistivity gas distribution plate202010,745,807Showerhead with reduced backside plasma ignition202010,697,061Two zone flow cooling plate design with concentric or spiral channel for efficient gas distribution assembly cooling202010,636,629Split slit liner door202010,625,277Showerhead having a detachable gas distribution plate202010,607,816Showerhead having a detachable high resistivity gas distribution plate202010,504,765Electrostatic chuck assembly having a dielectric filler201910,378,108Showerhead with reduced backside plasma ignition201910,373,810Showerhead having an extended detachable gas distribution plate201910,304,715Electrostatic chuck having thermally isolated zones with minimal crosstalk201910,177,050Methods and apparatus for controlling substrate uniformity20199,991,148Electrostatic chuck having thermally isolated zones with minimal crosstalk20189,909,213'Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors'20189,911,579'Showerhead having a detachable high resistivity gas distribution plate'20189,666,466'Electrostatic chuck having thermally isolated zones with minimal crosstalk'20179,639,097'Component temperature control by coolant flow control and heater duty cycle control'20179,610,591'Showerhead having a detachable gas distribution plate'20179,540,731'Reconfigurable multi-zone gas delivery hardware for substrate processing showerheads'20179,412,579'Methods and apparatus for controlling substrate uniformity'20169,394,615'Plasma resistant ceramic coated conductive article'20169,338,871'Feedforward temperature control for plasma processing apparatus'20168,880,227'Component temperature control by coolant flow control and heater duty cycle control'20146,983,892'Gas distribution showerhead for semiconductor processing'20066,863,835'Magnetic barrier for plasma in chamber exhaust'20056,831,742'Monitoring substrate processing using reflected radiation'20046,797,639'Dielectric etch chamber with expanded process window'20046,773,544'Magnetic barrier for plasma in chamber exhaust'20046,716,302'Dielectric etch chamber with expanded process window'20046,677,712'Gas distribution plate electrode for a plasma receptor'20046,605,177'Substrate support with gas feed-through and method'20036,586,886'Gas distribution plate electrode for a plasma reactor'20036,562,189'Plasma reactor with a tri-magnet plasma confinement apparatus'20036,500,299'Chamber having improved gas feed-through and method'20026,481,886'Apparatus for measuring pedestal and substrate temperature in a semiconductor wafer processing system'20026,432,259'Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates'20026,364,957'Support assembly with thermal expansion compensation'20026,320,736'Chuck having pressurized zones of heat transfer gas'20016,303,895'Method and apparatus for controlling a temperature of a wafer'20016,140,612'Controlling the temperature of a wafer by varying the pressure of gas between the underside of the wafer and the chuck'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2001Patents assigned to LAM RES CORP (2)· patent assignee history
2000–2021Based in Fremont, CA, US· patent location history
2001–2021Patents assigned to APPLIED MATERIALS INC (41)· patent assignee history
2014–2017Patents assigned to NOORBAKHSH HAMID (3)· patent assignee history
2014–2016Patents assigned to MAHADESWARASWAMY CHETAN (2)· patent assignee history
2014–2016Patents assigned to NGUYEN DUY D (2)· patent assignee history
2019–2021Based in Oakland, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 41 | 2001–2021 |
| NOORBAKHSH HAMIDself | 3 | 2014–2017 |
| LAM RES CORP | 2 | 2000–2001 |
| MAHADESWARASWAMY CHETAN | 2 | 2014–2016 |
| NGUYEN DUY D | 2 | 2014–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fremont, California, US | 39 | 2000–2021 |
| Oakland, California, US | 7 | 2019–2021 |