Inventor

Hiroo Suzuki

Inventor
Shizuoka, JP

Overview

26→
Patents
1977–2013
Patent span
Electricity
Primary field (CPC H)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification19%
H01RElectrically-conductive connections17%
H04JMultiplex communication8%
C22CAlloys6%
B24BMachines, devices, or processes for grinding or polishing4%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for4%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
G06FElectric digital data processing4%
H04BTransmission4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
8,486,550'Battery pack'20138,014,672'Optical wavelength multiplexing access system'20117,673,383'Apparatus for manufacturing a complete wire harness from a plurality of partial harnesses'20107,555,215'Optical wavelength division multiplexing access system'20097,206,510'Ring network using multi-wavelength generator'20077,127,168'Multi-wavelength optical modulation circuit and wavelength-division multiplexed optical signal transmitter'20066,607,426'Polishing apparatus'20036,578,891'Substrate holder and substrate transfer apparatus using the same'20036,457,151'Waveform controller for an IC tester'20026,414,840'Electronic appliance having open/close-type panel and method for reducing electromagnetic noise from open/close-type panel'20026,345,561'Wire measuring and cutting apparatus and method of measuring length of wire'20026,290,583'Apparatus for holding workpiece'20016,212,766'Apparatus for inserting terminal with wire and driving a wire sweeping arm'20016,195,884'Wire harness and method for manufacturing the same'20016,025,747'Logic signal selection circuit'20005,774,981'Terminal insertion method and apparatus'19985,697,147'Arm assembly for sweeping neighboring wires of already inserted terminal for inserting a new terminals with wire into a connector cavity'19975,459,924'Method of inserting terminal with wire and apparatus therefor'19955,355,583'Method and apparatus for inserting terminal'19945,348,702'Process for producing .gamma. and .beta. dual phase TiAl based intermetallic compound alloy'19945,232,661'.gamma. and .beta. dual phase TiAl based intermetallic compound alloy having superplasticity'19935,127,159'Method and apparatus for inserting terminal-carrying wire ends into a connector housing'19924,780,154'Shape memory alloy and method for producing same'19884,458,040'Aqueous coating resin composition'19844,379,482'Prevention of cracking of continuously cast steel slabs containing boron'19834,045,399'Curable aqueous coating composition'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–2002Based in Tokyo, JP· patent location history
1983–1994Patents assigned to NIPPON STEEL CORP (4)· patent assignee history
1983–2009Based in Yokohama, JP· patent location history
1992–2010Patents assigned to YAZAKI CORP (9)· patent assignee history
1992–2010Based in Shizuoka, JP· patent location history
1993–1994Based in Sagamihara, JP· patent location history
2000–2002Patents assigned to ADVANTEST CORP (2)· patent assignee history
2001–2003Patents assigned to EBARA CORP (3)· patent assignee history
2002–2013Based in Kanagawa, JP· patent location history
2006–2011Patents assigned to NIPPON TELEGRAPH & TELEPHONE (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
YAZAKI CORP91992–2010
NIPPON STEEL CORP41983–1994
NIPPON TELEGRAPH & TELEPHONE42006–2011
EBARA CORP32001–2003
ADVANTEST CORP22000–2002
Locations
LocationPatentsSpan
Shizuoka, JP71992–2010
Yokohama, JP51983–2009
Kanagawa, JP42002–2013
Tokyo, JP21977–2002
Sagamihara, JP21993–1994