Inventor
Daisuke Nakamata
Inventor
Chikuma, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B28Dprimary
B28DWorking stone or stone-like materials29%
B24BMachines, devices, or processes for grinding or polishing21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
B82YSpecific uses or applications of nanostructures7%
G01BMeasuring length, thickness or similar linear dimensions7%
G01QScanning-probe techniques or apparatus7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
9,662,805'Method of resuming operation of wire saw'20178,210,906'Slicing method and method for manufacturing epitaxial wafer'20128,167,681'Slicing method'20127,988,530'Slicing method'20117,810,383'Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor wafer'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2017Patents assigned to SHINETSU HANDOTAI KK (5)· patent assignee history
2010–2017Based in Nagano, JP· patent location history
2011–2012Based in Chikuma, JP· patent location history
2012Patents assigned to NAKAMATA DAISUKE (2)· patent assignee history
2012Patents assigned to OISHI HIROSHI (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU HANDOTAI KK | 5 | 2010–2017 |
| NAKAMATA DAISUKEself | 2 | 2012 |
| OISHI HIROSHI | 2 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chikuma, JP | 3 | 2011–2012 |
| Nagano, JP | 2 | 2010–2017 |