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Inventor

Sai Wang

Inventor
Kowloon, HK

Overview

2→
Patents
2013–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Rprimary
H01RElectrically-conductive connections50%
H04WWireless communication networks50%
PatentTitleYear
9,748,715'Modular socket panel and layer module for modular socket panel'20178,369,863'Method for interference suppression'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013Patents assigned to CUI QIMEI (1)· patent assignee history
2013Patents assigned to HU DAN (1)· patent assignee history
2013Patents assigned to LI HONGJIA (1)· patent assignee history
2013Patents assigned to LI YI (1)· patent assignee history
2013Based in Beijing, CN· patent location history
2017Patents assigned to SIPOMAC TECH COMPANY LTD (1)· patent assignee history
2017Based in Kowloon, HK· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CUI QIMEI12013
HU DAN12013
LI HONGJIA12013
LI YI12013
SIPOMAC TECH COMPANY LTD12017
Locations
LocationPatentsSpan
Kowloon, HK12017
Beijing, CN12013