Inventor
Ulrich Mantz
Inventor
Schelklingen, DE
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Jprimary
H01JElectric discharge tubes or discharge lamps24%
B82YSpecific uses or applications of nanostructures16%
G01BMeasuring length, thickness or similar linear dimensions14%
G01NInvestigating or analysing materials by determining their chemical or physical properties14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
Y10TTechnical subjects covered by former us classification5%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
PatentTitleYear
10,509,330Method and device for characterizing a wafer patterned using at least one lithography step20199,236,225'Ion sources, systems and methods'20169,012,867'Ion sources, systems and methods'20158,748,845'Ion sources, systems and methods'20148,723,138'Electron beam source and method of manufacturing the same'20148,384,029'Cross-section systems and methods'20138,164,071'Electron beam source and method of manufacturing the same'20128,110,814'Ion sources, systems and methods'20127,518,122'Ion sources, systems and methods'20097,485,873'Ion sources, systems and methods'20097,427,774'Targets for measurements in semiconductor devices'20087,405,089'Method and apparatus for measuring a surface profile of a sample'20087,362,453'Method for the characterization of a film'20087,358,491'Method and apparatus for the depth-resolved characterization of a layer of a carrier'20087,307,735'Method for determining the depth of a buried structure'20077,262,837'Noninvasive method for characterizing and identifying embedded micropatterns'20077,046,363'Optical measurement system and method'20066,486,675'In-situ method for measuring the endpoint of a resist recess etch process'20026,031,614'Measurement system and method for measuring critical dimensions using ellipsometry'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000Based in Poughkeepsie, NY, US· patent location history
2002–2008Patents assigned to INFINEON TECHNOLOGIES AG (8)· patent assignee history
2002–2008Based in Dresden, DE· patent location history
2006–2008Based in Saxony, DE· patent location history
2009–2012Patents assigned to ALIS CORP (3)· patent assignee history
2009–2019Based in Schelklingen, DE· patent location history
2012–2014Patents assigned to MANTZ ULRICH (5)· patent assignee history
2012–2014Patents assigned to ADERHOLD DIRK (2)· patent assignee history
2014–2016Patents assigned to CARL ZEISS MICROSCOPY LLC (3)· patent assignee history
2014Based in Schelkingen, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 8 | 2002–2008 |
| MANTZ ULRICHself | 5 | 2012–2014 |
| ALIS CORP | 3 | 2009–2012 |
| CARL ZEISS MICROSCOPY LLC | 3 | 2014–2016 |
| ADERHOLD DIRK | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Schelklingen, DE | 9 | 2009–2019 |
| Dresden, DE | 6 | 2002–2008 |
| Saxony, DE | 2 | 2006–2008 |
| Schelkingen, DE | 1 | 2014 |
| Poughkeepsie, New York, US | 1 | 2000 |